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Plus de 40 projets européens trouvés

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 TERMINÉ 

Photonic Integrated Circuits Assembly and Packaging Pilot Line (PIXAPP)

Date du début: 1 janv. 2017, Date de fin: 31 déc. 2020,

PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing ...
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 20

 TERMINÉ 

MidInfraRed PHotonics devices fABrication for chemical sensing and spectroscopic applications (MIRPHAB)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2019,

The MIRPHAB (Mid InfraRed PHotonics devices fABrication for chemical sensing and spectroscopic applications) consortium will establish a pilot line to serve the growing needs of European industry in the field of analytical micro-sensors. Its main objectives are to:• provide a reliable supply of mid-infrared (MIR) photonic components for companies incl. in particular SMEs already active in analytic ...
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 19

 TERMINÉ 

Modular laser based additive manufacturing platform for large scale industrial applications (MAESTRO)

Date du début: 1 oct. 2016, Date de fin: 30 sept. 2019,

...(CEA), Manufacturing technologies (UoB), Software Development (ALTAIR), MIM (OBE), SLM machine manufacturer (EOS). It is completed by 4 end-users from key sectors: Semiconductors and their packaging (III-V LAB), Automotive (CRF), Space (GEMMATE), Railway (ALSTOM).
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 10

 TERMINÉ 

All Solid-State Super-Twinning Photon Microscope (SUPERTWIN)

Date du début: 1 mars 2016, Date de fin: 28 févr. 2019,

...raction of the photon wavelength. Such microscopy technique will comprise building blocks for object illumination, capturing of scattered twinning photons and data processing. Based on advanced group-III nitride and III-V alloy epitaxial growths and wafer processing techniques we will build the first solid-state emitter of highly entangled photon states, utilizing the cooperative effect of Dicke s ...
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 9

 TERMINÉ 

FIber-Wireless Integrated Networks for 5th Generation delivery. (FIWIN5G)

Date du début: 1 janv. 2015, Date de fin: 31 déc. 2018,

This European Training Network aims to produce the next generation of early stage researchers who will enable Europe to take a leading role in the development of future devices, systems and networks supporting the 5G high-speed wireless internet. To do this, researchers must be able to work in interdisciplinary teams, integrate their activities, share expertise, and promote a vision of a converged ...
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 10

 TERMINÉ 

Postgraduate Research on Dilute Metamorphic Nanostructures and Metamaterials in Semiconductor Photonics (PROMIS)

Date du début: 1 janv. 2015, Date de fin: 31 déc. 2018,

Photonics, nanotechnology, advanced materials, and advanced manufacturing technologies have been identified as key enabling technologies (KETs) for the EU. Today the photonics global market alone is around €300 billion and Europe has established a strong position with a total share of 20%, directly employing about 290,000 people. However, the shortage of sufficient skilled labour and entrepreneurs ...
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 11

 TERMINÉ 

Optimal SIC substR ates for Integrated Microwave and Power CircuitS (OSIRIS)

Date du début: 1 mai 2015, Date de fin: 30 avr. 2018,

OSIRIS project, a Research and Innovation Action (RIA), aims at improving substantially the cost effectiveness and performance of gallium nitride (GaN) based millimetre wave components. The project proposes to elaborate innovative SiC material using isotopic sources. This material will offer thermal conductivity improvement of 30% which is important for devices dissipating a lot of power, in parti ...
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 9

 TERMINÉ 

in-line Cascade laser spectrometer for process control (iCspec)

Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,

...rdous conditions have to be detected without delay.The consortium represents the whole value added chain with major players in the field of mid-IR laser sources and their integration (nanoplus, III-V Lab), as well as a major player in the field of process analyzing equipment (Siemens AG). The contributions of scientifically established universities and institutes (CEA Leti, Universität Würzburg an ...
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 9

 TERMINÉ 

Thermally Integrated Smart Photonics Systems (TIPS)

Date du début: 1 févr. 2015, Date de fin: 31 janv. 2018,

The objective of this proposal is to develop and demonstrate a scalable, thermally-enabled 3D integrated optoelectronic platform that can meet the explosion in data traffic growth within ICT. The Thermally Integrated Smart Photonics Systems (TIPS) program will heterogeneously integrate micro-thermoelectric coolers (μTEC) and micro-fluidics (μFluidics) with optoelectronic devices (lasers, modulator ...
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 10

 TERMINÉ 

InP DHBT MMIC Technology for Millimeter-Wave Power Applications (IN-POWER)

Date du début: 1 févr. 2014, Date de fin: 31 janv. 2018,

"With the advent of smart phones, tablets and connected cameras, mobile data traffic is growing at a very fast pace. The capacity of mobile backhaul network must be increased to deal with this data explosion. In that respect there is at present an increased interest in exploiting the millimeter-wave frequency range (30-300 GHz) for wireless backhauling. The progress in semiconductor device technol ...
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 2

 TERMINÉ 

Innovative ultra-BROadband ubiquitous Wireless communications through terahertz transceivers (iBROW)

Date du début: 1 janv. 2015, Date de fin: 31 déc. 2017,

The demand for broadband content and services has been growing at tremendous rates, and predictions indicate that wireless data-rates of multiple tens of Gbps will be required by the year 2020, essentially for short-range connectivity. Currently available wireless technology cannot support these future demands, and so there is an urgent need to develop new technology platforms that are cost and en ...
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 11

 TERMINÉ 

Generic Technologies for WDM Transmitter Photonic Integrated Circuits (GeTPICs)

Date du début: 1 janv. 2014, Date de fin: 31 déc. 2017,

The project aims at achieving the improvement of Photonic Integrated Circuit (PIC) building blocks (BBs) for generic integration technology, the design and fabrication of high bit-rate transmitter PICs, typically WDM 10x 25Gbps and 4x 25GBau Tx PIC as test vehicles for the deve-loped BBs, and finally the test and validation of the fabricated PICs in a transmission environment. The program addresse ...
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 2

 TERMINÉ 

HIGH-POWER PHOTONICS FOR SATELLITE LASER COMMUNICATIONS AND ON-BOARD OPTICAL PROCESSING (HIPPO)

Date du début: 20 sept. 2013, Date de fin: 1 avr. 2017,

Photonics is transforming from a highly-focused telecom technology into a pervasive “enabling” technology. Photonics has the potential to play a critical role in space missions and Europe has the opportunity to lead. In this context, HIPPO aims to lead the “high power photonics” trend and develop a new generation of high-power optical components and modules. HIPPO will do this guided by a leading ...
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 5

 TERMINÉ 

Photonic Libraries And Technology for Manufacturing (PLAT4M)

Date du début: 1 oct. 2012, Date de fin: 31 mars 2017,

Description "PLAT4M will make silicon photonics ready for transition to industry"Silicon is now a mature integration platform that has brought CMOS microelectronics to mass-market application. The PLAT4M vision is that silicon photonics will lead to a similar revolution in the photonics sector.Over the past years silicon photonics has see ...
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 18

 TERMINÉ 

PAssive and electro-optic polymer photonics and InP electronics iNtegration for multi-flow Terabit transceivers at edge SDN switcHes and data-centER gateways (PANTHER)

Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,

Multi-rate, multi-format and multi-reach operation of optical transceivers is important, but it is not enough for next generation terabit products. What is still missing to make these products viable is a solution for the flexible control of this enormous capacity at the optical layer and its distribution among a number of independent optical flows. PANTHER aims to provide this solution and develo ...
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 8

 TERMINÉ 

Broadband Integrated and Green Photonic Interconnects for High-Performance Computing and Enterprise Systems (BIG PIPES)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

Big Data requires Big Pipes. Driven by mobile devices, cloud computing and machine-to-machine Internet, the amount of data processed by data centres continues to grow with a steep progression. Ongoing trends in server virtualisation and green computing morph the data centre architecture and place increasing constraints on the interconnect technology. To meet the need for increased bandwidth, trans ...
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 7

 TERMINÉ 

Integrated Photonic Broadband Radio Access Units for Next Generation Optical Access Networks (IPHOBAC-NG)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

IPHOBAC-NG addresses application-specific lasers, optical modulators and detectors to construct novel photonic millimeter-wave radios (PMWR) providing a) complementary broadband 1-10 Gb/s wireless access and b) 3 Gb/s mobile backhaul; both being seamlessly integrated in next generation optical access (NGOA) networks based upon a WDM-PON infrastructure. The proposed PMWR will employ novel radio acc ...
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 8

 TERMINÉ 

Energy efficient Silicon transmittEr using heterogeneous integration of III-V QUantum dOt and quantum dash materIAls (SEQUOIA)

Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,

...ine the assets of integrated photonics and CMOS technologies. The SEQUOIA project intends to make significant new advances in silicon photonic integrated circuits by heterogeneously integrating novel III-V materials, namely quantum dot and quantum dash-based materials on silicon wafers, through wafer bonding. Thanks to the superior properties of those innovative materials, hybrid III-V lasers with ...
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 6

 TERMINÉ 

Mid InfraRed Innovative lasers For Improved SENSor of hazardous substances (MIRIFISENS)

Date du début: 1 sept. 2012, Date de fin: 31 août 2016,

The mid-infrared (MIR) region is emerging as the favourite wavelength band for a number of applications, including high sensitivity trace detection, chemical emission monitoring, process control, and biological sensing applications. An efficient way to get precise and reliable information is to rely on spectroscopic analysis and, among the existing technologies, Tunable Diode Laser Spectroscopy (T ...
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 18

 TERMINÉ 

FDMA Access By Using Low-cost Optical Network Units in Silicon Photonics (FABULOUS)

Date du début: 1 oct. 2012, Date de fin: 30 juin 2016,

... characterization, optimization and monolithic/hybrid integration of photonic and electronic components to implement a low-cost/low power consumption R-ONU, using Silicon Photonics, CMOS/BiCMOS and III-V-on-silicon technologies. The final packaged device will integrate RX/TX functionality, electronic functions and optical amplification into a single chip.•Experimental study of the proposed NG-PON2 ...
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 8

 TERMINÉ 

Environmental Sensors for Energy Efficiency (ESEE)

Date du début: 1 avr. 2013, Date de fin: 31 mars 2016,

ESEE – Environment Sensors for Energy Efficiency targets the markets, were with highly reliable information regarding environmental conditions measures can be deducted, which safe the use of energy. The research will be performed on several different sensor technoglogy approaches and finally validated in a test environment, e.g. under the environmental conditions of an aircraft. In addition an app ...
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 27

 TERMINÉ 

COst-effective COhereNt Ultra-dense-WDM-PON for lambda-To-the-user access networks (COCONUT)

Date du début: 1 nov. 2012, Date de fin: 29 févr. 2016,

The COCONUT proposal aims at the definition, study and realization of a new fully scalable optical access network significantly extending the network dimensions in terms of bandwidth utilization, reach and number of accommodated users. The envisioned access network evolves from the almost-commercial WDM-PON architecture to the realisation of the Ultra-Dense WDM solutions, opening the way to the "w ...
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 8

 TERMINÉ 

High Brightness Semiconductor Laser Sources for Space Applications in Earth Observation (BRITESPACE)

Date du début: 1 déc. 2012, Date de fin: 29 févr. 2016,

The availability of suitable laser sources is one of the key issues for the development of active optical instruments in future earth observation missions. The main objective of this project is to demonstrate the feasibility of a semiconductor based laser source to be used as a laser transmitter in a Differential- Absorption LIDAR (DIAL) system for the observation and monitoring of greenhouse gase ...
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 6

 TERMINÉ 

The DIStributed Core for unlimited bandwidth supply for all Users and Services (DISCUS)

Date du début: 1 nov. 2012, Date de fin: 31 déc. 2015,

DISCUS will analyse, design, and demonstrate a complete end-to-end architecture and technologies for an economically viable, energy efficient and environmentally sustainable future-proof optical network. It will provide a revolution in communications networks applicable across Europe and the wider world exploiting to the full the opportunity offered by LR-PONS and flat optical core networks to pro ...
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 12

 TERMINÉ 

Detection of Olfactory traces by orthoGonal Gas identification technologIES (DOGGIES)

Date du début: 1 juin 2012, Date de fin: 30 nov. 2015,

"Border security is one of the key security challenges to be taken up by Europe in the following years. In particular, the deployment of practical efficient means to detect hidden persons and illegal substances at border crossing points is instrumental in avoiding terrorism, human trafficking or smuggling.The DOGGIES project aims at demonstrating (1) an operational movable stand alone sensor for a ...
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 14

 TERMINÉ 

Postgraduate Research on Photonics as an Enabling Technology (PROPHET)

Date du début: 1 janv. 2011, Date de fin: 30 sept. 2015,

"Photonics is an important enabling technology for a wide range of applications in diverse areas. The photonics industry in Europe accounted for revenues of €49 billion in 2006, and is expected to soon exceed that of microelectronics. In the training network proposed here, a cohort of 14 early stage researchers and 5 young experienced researchers will be trained in the full gamut of skills require ...
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 14

 TERMINÉ 

"Novel semiconductor Optical sources for Metrology, Signal PrOcessing and Space applications." (NOMOS)

Date du début: 1 oct. 2013, Date de fin: 30 sept. 2015,

...edge emitting lasers, have found a niche in telecom market. At the same time novel application domains appear related to expansion of the wavelength range due to novel material systems such as group-III nitrides and advance in optical frequency comb technology.The project aims at developing the Mode-Locked Semiconductor Laser technology which have the best potential for LIDAR applications, especia ...
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 1

 TERMINÉ 

VEry LOw jitter MOde LOcked laser at 780nm for optical sampling applications (VELO MOLO_780)

Date du début: 2 sept. 2013, Date de fin: 1 sept. 2015,

"The project investigates prospective configuration of pulsed laser source for the use in photonic assister analog to digital converters. This application oriented project is based on strong interdisciplinary linkage and aims to develop compact, efficient and low cost pulsed sources.System requirements for a pulsed laser source are to be met by means of mode-locking from either monolithic laser di ...
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 1

 TERMINÉ 

Photonic Advanced Research And Development for Integrated Generic Manufacturing (PARADIGM)

Date du début: 1 oct. 2010, Date de fin: 31 mai 2015,

..., which could only be contemplated with a consortium possessing a wide range of complementary skills. PARADIGM has brought together just such a collaboration of Europe's key players in the fields of III-V semiconductor manufacturing, PIC design and applications, photonic CAD, packaging and assembly.The project will verify the potential of the generic approach by fabricating a number of InP PICs, ...
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 19

 TERMINÉ 

Compact uLtrA-efficient mid-infRared photonIc sysTems based on low noise quantum cascade laser sources, wide band frequencY converters and near-infrared photodetectors (CLARITY)

Date du début: 1 sept. 2011, Date de fin: 28 févr. 2015,

...d-infrared to near-infrared converters relying on third order nonlinear effects in silicon waveguides and soft-glass fibres.3.\tDesign and implement mid-infrared photonic integrated circuits based on III-V and IV materials capable of bringing together the novel technological concepts of the project in a single chip.Upon its completion, the project will deliver a new class of MIR tools offering at ...
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 6

 TERMINÉ 

HYbrid III-V/Silicon laSer for the future generation of Photonic integrated circuits (HYSSOP)

Date du début: 1 mars 2013, Date de fin: 28 févr. 2015,

...Such sources constitute the main technological roadblock hindering the development of silicon photonics based systems.The overall objective of the present project is to demonstrate the feasibility of III-V/Si lasers complying with the needs of the future generation of photonic integrated circuits. The mainstream approach is based on the development of quantum dash sources with disruptive performan ...
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 1

 TERMINÉ 

Embedded Resonant and ModulablE Self-Tuning Laser Cavity for Next Generation Access Network Transmitter (ERMES)

Date du début: 1 sept. 2011, Date de fin: 31 août 2014,

For the Next Generation Access Network (NGAN) wavelength division multiplexed passive optical networks (WDM PON) appear a promising and suitable solution offering almost unlimited bandwidth similarly to point-to-point links, while allowing the advantages of fibre sharing.It is widely recognized that WDM PON deployment requires colourless Optical Network Unit (ONU) transmitters, so that each user h ...
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 6

 TERMINÉ 

AlGaN and InAlN based microwave components (AL-IN-WON)

Date du début: 1 nov. 2010, Date de fin: 30 avr. 2014,

"This proposal is focused on the development of a new generation of wide band gap (WBG) GaN technology and devices for which strong impacts in term of performances, reliability and robustness are expected.AL-IN-WON will explore two main disrupting routes:- Next generation of WBG device based on new epi material (InAlN/GaN) for strong improvement in term of performances and reliability.- High effi ...
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 7

 TERMINÉ 

POLYSYS: Direct 100G connectivity with optoelectronic POLYmer-InP integration for data center SYstems (POLYSYS)

Date du début: 1 oct. 2010, Date de fin: 31 janv. 2014,

Optical connectivity in data centers relies on 10Gb/s parallel optics that raise scalability and energy consumption issues. Efforts towards advanced modulation formats pose severe system complexity. The upgrade to 100 Gb/s to resolve the bandwidth bottleneck and increase the throughput of optical interconnect backplanes requires a disruptive yet straightforward solution. POLYSYS aims to provide th ...
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 5

 TERMINÉ 

Drugs and Precursor Sensing by Complementing Low Cost Multiple Techniques (CUSTOM)

Date du début: 1 juin 2010, Date de fin: 30 nov. 2013,

A large number of techniques have been developed in the latest decades, which are able to screen and identify specific molecules for drug precursors detection even at very low concentration in lab testing.Nevertheless the objective to build up a system which proves to be easy to use, compact, able to provide screening over a large number of compounds and discriminate them with low false alarm (FA) ...
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 11

 TERMINÉ 

Integrated photonic transceivers at sub-terahertz wave range for ultra-wideband wireless communications (iPHOS)

Date du début: 1 juin 2010, Date de fin: 30 nov. 2013,

This project targets the development of compact and low power transceivers that enable wireless data transfer at sub-terahertz carrier frequencies and their application to future high data-rate short-distance communication links. The interest of the topic relies in the fact that advances in semiconductor technology, favourable spectrum policy and demand for gigabit throughput capabilities have cre ...
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 9

 TERMINÉ 

High Quality European GaN-Wafer on SiC Substrates for Space Applications (EuSiC)

Date du début: 1 nov. 2010, Date de fin: 31 oct. 2013,

...y of semi-insulating SiC-substrates at SiCrystal AG, the leading manufacturer of SiC substrates in Europe. The provided substrates shall be analyzed and evaluated by epi-growth specialists IAF, III-V-Lab, and QinetiQ. Finally devices shall be built and verified on the created GaN epi-wafers by UMS. Continuous monitoring and several feedback loops to the quality of the substrates will enable an acc ...
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 5

 TERMINÉ 

Monolithic InP-based Dual Polarization QPSK Integrated Receiver and Transmitter for CoHerent 100-400Gb Ethernet (MIRTHE)

Date du début: 1 juil. 2010, Date de fin: 31 oct. 2013,

MIRTHE targets new multilevel-modulation all-monolithic integrated TX and RX Photonic Integrated Circuits (PICs) able to achieve 100-400 Gb/s aggregated speed on a single wavelength. This project is motivated by:- the reduction of cost and power consumption of 100Gb/s transmission equipment,- the need of future-proof component technologies for next generation terabit networks.Chips will be packa ...
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 7

 TERMINÉ 

Advanced characterisation of ELEctronic properties of GAllium Nitride based devices (ELEGAN)

Date du début: 11 juil. 2011, Date de fin: 10 juil. 2013,

"The project is focused on the characterisation and modelling of a new generation of wide band gap (WBG) GaN technology and devices for which strong impacts in terms of performance, reliability and robustness are expected.GaN material, despite its extraordinary properties and the strong demand of some markets (see following paragraphs) is still at R&D stage, mainly for reasons linked to a poor und ...
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 1

 TERMINÉ 

European 450mm Equipment & Materials Initiative (EEMI 450)

Date du début: 1 avr. 2010, Date de fin: 1 mars 2013,

Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
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 27