...es (20 µm), ultra high speed assembly (40,000 UPH), and flip-chip capabilities, while ensuring industry proven reliability. Led by AALTO, this consortium of 5 research centers and 4 industries (ST, NXP, BX, 3DPLUS) will join force to fulfil this urgent and important need of industry in 3D integration, and will demonstrate the merits in three industry led demonstrators: one manufacturing equipment ...