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29 projets européens trouvés

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 TERMINÉ 

3D Advanced Metrology and materials for advanced devices (3DAM)

Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,

The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges w ...
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 18

 TERMINÉ 

Smart Technologies for eneRgy Efficient Active cooling in advanced Microelectronic Systems (STREAMS)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2018,

The aim of STREAMS is to bring Europe into the new leading thermal management paradigm and maintain EU position at the forefront of ICT development. With a focused consortium gathering complementary experts, STREAMS will develop a generic active cooling thermal management solution (reaching TRL4), to keep nanoelectronic devices and systems performances at their best, while meeting IC future challe ...
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 7

 TERMINÉ 

CmOs Solutions for Mid-board Integrated transceivers with breakthrough Connectivity at ultra-low Cost (COSMICC)

Date du début: 1 déc. 2015, Date de fin: 30 nov. 2018,

...-Centers around a strong vision: mass commercialization of Si-photonics-based transceivers is possible starting in 2019 by enhancing the existing photonic integration platform of one of the partners, STMicroelectronics.COSMICC will develop optical transceivers that will be packaged on-board. Combining CMOS electronics and Si-photonics with innovative-high-throughput fiber-attachment techniques, th ...
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 11

 TERMINÉ 

Pilot Optical Line for Imaging and Sensing (POLIS)

Date du début: 6 janv. 2014, Date de fin: 6 janv. 2018,

The KET pilot line project POLIS is aimed at maintaining and furthering the innovation capability of CMOS image and optical sensors in Europe. An existing ST CMOS high volume production line, unique in Europe, will serve as the basis of the proposed project. The strategy behind POLIS lies in the development of specific technological modules and to implement them at pilot line level on the existing ...
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 20

 TERMINÉ 

PANACHE

Date du début: 2 janv. 2014, Date de fin: 2 janv. 2018,

Pilot line for Advanced Nonvolatile memory technologies for Automotive microControllers, High security applications and general Electronics :The PANACHE project objective is to set-up a pilot line for embedded Flash technology design and manufacturing platform for the prototyping of innovative µcontrollers in Europe.The current 40nm technology platform as well as the already defined 55nm technolog ...
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 21

 TERMINÉ 

Virtual Prototyping of Tactile Displays (PROTOTOUCH)

Date du début: 1 mai 2013, Date de fin: 30 avr. 2017,

"It is estimated that touch screen module revenues will reach $23.9 billion by 2017. These user interfaces have become one of the most common input devices for digital media, e.g. in mobile phones and computers. Current devices incorporate relatively primitive vibrotactile haptic-feedback. The aim of PROTOTOUCH is to develop tactile displays with high fidelity haptic recognition, so that buttons w ...
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 10

 TERMINÉ 

Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)

Date du début: 1 mai 2015, Date de fin: 30 avr. 2017,

...istributed pilot line between 2 companies: - Soitec for the fabrication of advanced engineered substrates (UTBB: Ultra Thin Body and BOx (buried oxide)) without and with strained silicon top film. - STMicroelectronics for the development and industrialization of state of the art FDSOI technology platform at 14nm and beyond with an industry competitive Power-Performance-Area-Cost (PPAC) trade-off. ...
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 32

 TERMINÉ 

Photonic Libraries And Technology for Manufacturing (PLAT4M)

Date du début: 1 oct. 2012, Date de fin: 31 mars 2017,

Description "PLAT4M will make silicon photonics ready for transition to industry"Silicon is now a mature integration platform that has brought CMOS microelectronics to mass-market application. The PLAT4M vision is that silicon photonics will lead to a similar revolution in the photonics sector.Over the past years silicon photonics has see ...
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 18

 TERMINÉ 

Green Computing Node for European micro-servers (EUROSERVER)

Date du début: 1 sept. 2013, Date de fin: 31 janv. 2017,

Description New 3D server architecture for better energy-efficient Data CentresData Centres (DCs) are a key resource for innovation and leadership of industry in Europe. They drive the Information Society through hosted cloud applications. To sustain the ever-increasing demand of storing and processing data, DCs need to improve their capa ...
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 14

 TERMINÉ 

Pilot Line For Self Assembly Copolymer Delivery (PLACYD)

Date du début: 1 janv. 2014, Date de fin: 1 janv. 2017,

The PLACYD project aims at strengthening the European leadership in the field of advanced lithography. The consortiums gathers the main European Rnull actors along the whole value chain (Material suppliers, equipment suppliers, semiconductor companies, CAD companies, research laboratories) in order to bring the key materials, processes and design tools for Directed Self Assembly (DSA) Lithography ...
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 11

 TERMINÉ 

Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D to equipment assessment experiments. The strategic objective is to effectively combine resources and expertise in a joint assessment of novel equipment for key enabling technologies to foster and accelerate the successful transfer of novel European equipment in ...
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 26

 TERMINÉ 

Compound Semiconductors for 3D integration (COMPOSE3)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

COMPOSE3 aims to develop 3D stacked circuits in the front end of line of Complementary Metal Oxide Semiconductor (CMOS) technology, based on high mobility channel materials. The final objective is a 3D stacked SRAM cell, designed with gates length taken from the 14nm technology node. This technology will provide a new paradigm shift in density scaling combined with a dramatic increase in the power ...
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 10

 TERMINÉ 

Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe (PLACES2BE)

Date du début: 3 déc. 2012, Date de fin: 31 déc. 2015,

Objectives: The general goal of this project is the industrialization of 28/20nm Fully Depleted (FD) Silicon On Insulator (SOI) Technology platforms, enabling 2 different sources in 2 different European countries. The project also aims at establishing and reinforcing a design ecosystem in Europe using these platforms. Last, the project considers extremely important to explore extension towards FD ...
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 22

 TERMINÉ 

Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs (INTEGRATE)

Date du début: 1 janv. 2013, Date de fin: 31 déc. 2015,

European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and product diversity. The project aims at conducting research to support the development of new manufacturing procedures, new organizations and new information and control tools to enable IC production lines to efficiently manage a high product and technology mix and ...
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 29

 TERMINÉ 

Fully Networked, Digital Components for Photon-starved Biomedical Imaging Systems (SPADnet)

Date du début: 1 juil. 2010, Date de fin: 31 déc. 2014,

Description SPADnet aims to develop a new generation of smart, CMOS-based large area networked image sensors for photon-starved biomedical applications, build ring-assembly modules for Positron Emission Tomography (PET) imaging, and carry out performance tests in a PET system evaluation testbed.While suited to applications offering repetitiv ...
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 9

 TERMINÉ 

Semiconductor Industry Leading towards Viable Energy Recovery (SILVER)

Date du début: 1 janv. 2012, Date de fin: 1 déc. 2014,

There is no doubt that ICT, supported by semiconductor technology, can play in using more efficiently energy resources and in allowing the adoption of renewable energy production, care must be taken that the complete life cycle of the envisaged technologies is considered, and that also the energy costs for the production of the critical semiconductor components are minimized. This concept applies ...
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 14

 TERMINÉ 

Advanced TEchnology MOdelling for eXtra-functionality devices (ATEMOX)

Date du début: 1 juil. 2010, Date de fin: 30 nov. 2013,

... implement and include them into the Sentaurus TCAD platform of Synopsys so that they are of immediate value to the European semiconductor industry. The integrated models will finally be evaluated by STMicroelectronics with respect to industrial needs. To reach these ambitious goals, European companies active in complementary fields of competence  and leading European research institutes have form ...
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 14

 TERMINÉ 

Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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 39

 TERMINÉ 

Beyond CMOS Nanodevices for Adding Functionalities\nto CMOS (NANOFUNCTION)

Date du début: 1 sept. 2010, Date de fin: 31 août 2013,

Description NANOFUNCTION addresses the merging of advanced More than Moore (MtM) devices with Beyond-CMOS. Topics: Si nanowires for sensing, on-chip energy harvesting, nano-cooling and porous Si for RF passives.The NANOFUNCTION project aims to integrate at the European level the excellent European research laboratories in order to strengt ...
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 21

 TERMINÉ 

Millimeter-wave and Radio-frequency integration in Nanoelectronics for Modern Wireless 5 A Communications (MIRANDELA)

Date du début: 1 mai 2010, Date de fin: 1 avr. 2013,

The ENIAC JU project MIRANDELA is building a complete digital, mixed-signal, analogue, radio frequency (RF) and millimetre-wave (MMW) platform for the design and production of chips for future wireless communications to address the challenge of transferring anything, from/to anybody, anywhere, at any time and through any path. Components in core CMOS technology and other processes will be characte ...
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 24

 TERMINÉ 

Guardian Angels for a Smarter Life (Guardian Angels)

Date du début: 1 mai 2011, Date de fin: 30 avr. 2012,

Guardian Angels (GA) are future zero-power, intelligent, autonomous systems-of-systems featuring sensing, computation, and communication beyond human aptitudes. GA will assist humans from their infancy to old age in complex life situations and environments. Zero-power reflects system-of-systems ability to scavenge energy in dynamic environments by disruptive harvesting techniques. The project prep ...
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 34

 TERMINÉ 

E3Car -> Nanoelectronics for an energy efficient electrical car (E3CAR)

Date du début: 1 févr. 2009, Date de fin: 1 janv. 2012,

The objective of the project is the development of nanoelectronics technologies, devices, circuits architectures and modules for electrical cars/vehicles and demonstration of these modules in a final systems.Emissions from road vehicles have to be reduced substantially in the future. The ultimate goal of most car manufacturers is to get to a completely electric vehicle, protecting the environment ...
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 32

 TERMINÉ 

Lithography Enhancement towards Nano Scale (LENS)

Date du début: 1 janv. 2009, Date de fin: 1 déc. 2011,

Water immersion lithography has been widely accepted as patterning technology for the 45nm technology node, but solutions for the patterning of 32nm and 22nm technology nodes are not clear yet.EUV lithography is not yet available for industrial use, in spite of the impressive progresses registered till now, while multiple beam e beam lithography is still in development. Double patterning seems to ...
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 12

 TERMINÉ 

Towards 0.5 Terahertz Silicon/Germanium Heterojunction Bipolar Technology (DOTFIVE)

Date du début: 1 févr. 2008, Date de fin: 31 juil. 2011,

DOTFIVE is a three-year IP proposal for a very ambitious project focused on advanced RTD activities necessary to move the Silicon/germanium heterojunction bipolar transistor (HBT) into the operating frequency range of 0.5 terahertz (THz) (500 gigahertz GHz) enabling the future development of communication, imaging or radar Integrated Circuits (IC) working at frequencies up to 160 GHz . For a giv ...
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 20

 TERMINÉ 

Dual-channel CMOS for (sub)-22 nm high performance logic (DUALLOGIC)

Date du début: 1 déc. 2007, Date de fin: 31 mai 2011,

We propose to develop for the first time a dual-channel CMOS technology comprising high channel mobility (high-µ) Ge pMOS and III-V compound semiconductor nMOS transistors co-integrated on the same complex engineered substrate on Si. This offers a high performance booster as an option for the 22 nm technology creating competitive advantage for the European nanoelectronics industry. In addition, hi ...
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 9

 TERMINÉ 

Silicon-based nanostructures and nanodevices for long term nanoelectronics applications (NANOSIL)

Date du début: 1 janv. 2008, Date de fin: 31 mars 2011,

NANOSIL Network of Excellence aims to integrate at the European level the excellent European research laboratories and capabilities in order to strengthen scientific and technological excellence in the field of nanoelectronic materials and devices for terascale integrated circuits (ICs) and disseminate the results in a wide scientific and industrial community.NANOSIL will explore and assess the sc ...
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 38

 TERMINÉ 

MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)

Date du début: 1 janv. 2008, Date de fin: 31 déc. 2010,

...y of the electron beam lithography and a reasonable throughput target represents an attractive alternative for lithography and is supported by some key CMOS manufacturers around the world, like TSMC, STMicroelectronics, QIMONDA, TOSHIBA, and Texas Instruments.This project proposes to support the development of ML2 technology in Europe. It is composed of two linked poles. The first one will be focu ...
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 19

 TERMINÉ 

Pan-European Reseach Infrastructure for Nano-Structures (PRINS)

Date du début: 1 avr. 2008, Date de fin: 31 mars 2010,

The project focuses on all needed preparatory actions to enable in the following phase the construction of a Research Infrastructure (RI) called Pan-European Research Infrastructure for Nano-Structures (PRINS), with the aim of enabling European innovative research for the ultimate scaling of electronics component and circuits. The platform will be truly interdisciplinary by allowing the convergenc ...
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 10

 TERMINÉ 

Material Development for Double exposure and Double patterning (MD3)

Date du début: 1 déc. 2007, Date de fin: 30 nov. 2009,

Double patterning lithography has been identified as one of the most promising solutions for the 32nm node patterning. This technique refers to a two step process where a first pattern is exposed, developed and sometimes etched and a second pattern is also exposed, developed and transferred on the top of the first one. For the moment, several issues still need to be addressed for enabling the Doub ...
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 7