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24 projets européens trouvés

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 TERMINÉ 

Ultra-Scalable and Ultra-Efficient Integrated and Visual Big Data Analytics (LeanBigData)

Date du début: 1 févr. 2014, Date de fin: 31 janv. 2017,

LeanBigData aims at addressing three open challenges in big data analytics: 1) The cost, in terms of resources, of scaling big data analytics for streaming and static data sources; 2) The lack of integration of existing big data management technologies and their high response time; 3) The insufficient end-user support leading to extremely lengthy big data analysis cycles. LeanBigData will address ...
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 11

 TERMINÉ 

Intel-CERN European Doctorate Industrial Program (ICE-DIP)

Date du début: 1 févr. 2013, Date de fin: 31 janv. 2017,

"ICE-DIP, the Intel-CERN European Doctorate Industrial Program, is an EID scheme hosted by CERN and Intel Labs Europe. ICE-DIP offers research training to 5 Early Stage Researchers (ESRs) in advanced Information and Communication Technologies (ICT). The technical goal of this program is to research and develop, through a public-private partnership, unparalleled capabilities in the domain of high t ...
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 2

 TERMINÉ 

Water analytics and Intelligent Sensing for Demand Optimised Management (WISDOM)

Date du début: 1 févr. 2014, Date de fin: 31 janv. 2017,

...sing variability of both supply and consumption will also require more sophisticated and optimized decision making.To achieve a step change in water and energy savings we propose to apply and test an intelligent ICT system for "real time abstraction & discharge monitoring". This will create an open, scalable, marketable and user-friendly system to optimise water resource management and replace the ...
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 13

 TERMINÉ 

Pilot Line For Self Assembly Copolymer Delivery (PLACYD)

Date du début: 1 janv. 2014, Date de fin: 1 janv. 2017,

The PLACYD project aims at strengthening the European leadership in the field of advanced lithography. The consortiums gathers the main European Rnull actors along the whole value chain (Material suppliers, equipment suppliers, semiconductor companies, CAD companies, research laboratories) in order to bring the key materials, processes and design tools for Directed Self Assembly (DSA) Lithography ...
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 11

 TERMINÉ 

An integrated development environment for portable network applications (NetIDE)

Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,

While most of programmable network gear vendors support OpenFlow nowadays, a number of fragmented control plane solutions exist for proprietary software-defined networks. Thus, network applications developers need to re-code their solutions every time they target a network infrastructure based on a different controller. Moreover, different network developers adopt different solutions as abstract c ...
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 10

 TERMINÉ 

Network Functions as-a-Service over Virtualised Infrastructures (T-NOVA)

Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,

Network Functions Virtualisation (NFV) is an emerging concept, which refers to the migration of certain network functionalities, traditionally performed by hardware elements, to virtualized IT infrastructures, where they are deployed as software components. NFV leverages commodity servers and storage, including cloud platforms, to enable rapid deployment, reconfiguration and elastic scaling of net ...
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 19

 TERMINÉ 

Agile Service Engineering for the Future Internet (CloudWave)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

CloudWave will revolutionise modern cloud infrastructures and tools by enabling agile development and delivery of adaptive cloud services which dynamically adjust to changes in their environment so as to optimise service quality and resource utilization. In doing so, CloudWave will advance the competitiveness of the EU economy by providing a powerful foundation, based on open standards, for creati ...
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 15

 TERMINÉ 

Coordination Action to enable an effective European 450 mm Equipment & Materials Network (ENABLE450)

Date du début: 1 nov. 2012, Date de fin: 31 oct. 2016,

5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently ordering and installing the first wave of 450 mm systems. The major drivers of this effort are Intel and TSMC, which have provide ...
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 13

 TERMINÉ 

European 450mm Equipment Demo Line (E450EDL)

Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,

The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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 44

 TERMINÉ 

Strategies for Assessment of Inquiry Learning in Science (SAILS)

Date du début: 1 janv. 2012, Date de fin: 31 déc. 2015,

The aim of this proposal is to support teachers in adopting inquiry based science education (IBSE) at second level (students aged 12-18 years) across Europe. This will be achieved by utilising existing resources and models for teacher education in IBSE both pre-service and in-service. In addition to SAILS partners adopting IBSE resources within their curricula and implementing teacher education in ...
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 15

 TERMINÉ 

Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs (INTEGRATE)

Date du début: 1 janv. 2013, Date de fin: 31 déc. 2015,

European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and product diversity. The project aims at conducting research to support the development of new manufacturing procedures, new organizations and new information and control tools to enable IC production lines to efficiently manage a high product and technology mix and ...
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 29

 TERMINÉ 

Advanced Platform for Manufacturing Engineering and Product Lifecycle Management (amePLM)

Date du début: 1 oct. 2011, Date de fin: 31 mars 2015,

Product and production engineering in companies are typically fragmented across different functional units, distributed across companies along the value chain, requiring input from experts from a variety of disciplines using different methods and tools. This leads to a high coordination effort to synergise work and information transfer as well as to sub-optimal decisions and unused knowledge and e ...
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 15

 TERMINÉ 

European E&M 450mm Pilotline Readiness (EEM450PR)

Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,

Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
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 32

 TERMINÉ 

European Schools enhancing creativity, exploration and science (we.learn.it)

Date du début: 1 nov. 2012, Date de fin: 28 févr. 2015,

we.learn.it will launch the European Living Learning Network by schools and for schools.we.learn.it is a facilitated grassroots initiative initially formed from school networks in 6 European countries and partnerships abroad including schools in developing countries. Linked to a facilitators network of higher education institutions, thematic organizations, experts, learning content and technology ...
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 9

 TERMINÉ 

Integrated and Interoperable ICT Applications for Electro-Mobility in Europe (MOBI.Europe)

Date du début: 1 janv. 2012, Date de fin: 31 déc. 2014,

MOBI.Europe will promote the full integration and interoperability of a cloud of ICT applications associated with electro-mobility, which were already developed and are in the process of being tested. It is built upon the Portuguese, the Irish, the city of Amsterdam (The Netherlands), and the Galician (Spain) ongoing electro-mobility initiatives. Involving all the relevant stakeholders, it will be ...
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 12

 TERMINÉ 

FI-WARE: Future Internet Core Platform (FI-WARE)

Date du début: 1 mai 2011, Date de fin: 31 déc. 2014,

The goal of the FI-WARE project is to advance the global competitiveness of the EU economy by introducing an innovative infrastructure for cost-effective creation and delivery of services, providing high QoS and security guarantees. FI-WARE is designed to meet the demands of key market stakeholders across many different sectors, e.g., healthcare, telecommunications, and environmental services. FI- ...
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 92

 TERMINÉ 

Digital Preservation for Timeless Business Processes and Services (TIMBUS)

Date du début: 1 avr. 2011, Date de fin: 31 déc. 2014,

Description TIMBUS extends traditional digital preservation approaches by introducing the need to analyse and preserve services, and by aligning preservation actions with business continuity management.A primary motivation for TIMBUS is the declining use of centralised in-house business processes. Based on the concept of software as a ser ...
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 12

 TERMINÉ 

Self Orchestrating CommunIty ambiEnT IntelligEnce Spaces (SOCIETIES)

Date du début: 1 oct. 2010, Date de fin: 30 avr. 2014,

Pervasive systems aim to seamlessly and unobtrusively enable individual users to interact with devices, networks and services in their vicinity. Until now their focus has been on the individual rather than on communities of users. This neglects an important part of human behaviour; socialising, and might partly explain the slow take-up of pervasiveness in commercial products. Social computing, on ...
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 14

 TERMINÉ 

Knowledge, Awareness and Prediction of Man, Machine, Material and Method in Manufacturing (KAP)

Date du début: 1 sept. 2010, Date de fin: 31 déc. 2013,

Manufacturing is the driving force of Europe's economy, providing over €6,553 billion in GDP. However against a background of climate change legislation, volatile energy prices and increased environmental awareness, modern manufacturing must encompass a focus on eco-efficiency. Given the current economic situation, this must be achieved without the need for large capital expenditure. Adding inform ...
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 15

 TERMINÉ 

Production Logistics and Sustainability Cockpit (PLANTCockpit)

Date du début: 1 sept. 2010, Date de fin: 31 déc. 2013,

...ntegration standards such as ISA 95, OAGIS, OPC Unified Architecture, MTConnect will be used as starting points.The well-balanced consortium of PLANTCockpit includes world-leading system providers (INTEL, SAP), technology leaders (Iconics), strong academic partners (EPFL, TECNALIA, POLIMI, TUD, TUT), and high-profile end-users (ACCIONA, BMW, COMAU, DOEHLER).
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 13

 TERMINÉ 

Large Area Molecularly Assembled Nanopatterns for Devices (LAMAND)

Date du début: 1 juil. 2010, Date de fin: 30 juin 2013,

Scaling has driven the microelectronics industry for over 40 years and revolutionised information and communication technologies, health care, education, engineering, etc. Maintaining progress has becomes more challenging and costs of fabrication facilities are rising exponentially. Possible technical/cost solutions centre on development of ‘bottom-up’ techniques to (nano)pattern (the patterns yie ...
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 9

 TERMINÉ 

Reduced Certification Costs for Trusted Multi-core Platforms (RECOMP)

Date du début: 1 avr. 2010, Date de fin: 31 mars 2013,

"The proposed RECOMP (Reduced certification cost for trusted multi-core platforms) research project will establish methods, tools and platforms for enabling cost-efficient certification and re-certification of safety-critical systems and mixed-criticality systems, i.e. systems containing safety-critical and non-safety-critical components.RECOMP recognizes the fact that the increasing processing po ...
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 40

 TERMINÉ 

European 450mm Equipment & Materials Initiative (EEMI 450)

Date du début: 1 avr. 2010, Date de fin: 1 mars 2013,

Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
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 27

 TERMINÉ 

Initial Training Network in Nanoscale Semiconductor Spintronics (SemiSpinNet)

Date du début: 1 déc. 2008, Date de fin: 30 nov. 2012,

We propose an Initial Training Network for advanced nanoscale semiconductor spintronics. This is a coordinated programme of technological, experimental and theoretical research, training and knowledge transfer, by a consortium of leading European academic and industrial research groups. Spintronics is becoming increasingly important as downscaling and power usage in microelectronics approaches fun ...
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 12