7 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
3D Advanced Metrology and materials for advanced devices (3DAM)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges w ...
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18
Participants partenaires
TERMINÉ
Seven Nanometer Technology (SeNaTe)
Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,
The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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41
Participants partenaires
TERMINÉ
Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)
Date du début: 1 mai 2015, Date de fin: 30 avr. 2017,
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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32
Participants partenaires
TERMINÉ
European 450mm Equipment Demo Line (E450EDL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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44
Participants partenaires
TERMINÉ
Compact X-ray computed tomography system for non destructive characterization of nano materials (NANOXCT)
Date du début: 1 mai 2012, Date de fin: 30 avr. 2015,
Within the past decades, advances in miniaturization from micro to nano-scale have had dramatic impacts on our lives. Consumer electronics, which once occupied large volumes, now fit in the palm of a hand. But nanotechnology does not only improve in electronics. Also material sciences, chemical engineering, or biology are strongly profiting from nanotechnology. The tremendous achievements in all o ...
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10
Participants partenaires
TERMINÉ
Integrated sensing and imaging devices for designing, monitoring and controlling microstructure of foods (InsideFood)
Date du début: 1 mai 2009, Date de fin: 30 avr. 2013,
The main S&T objective of InsideFood is to provide technological solutions for sensing the microstructure of foods. The project will develop and combine X-ray nano- and microtomography, nuclear magnetic resonance spectrocopy, magnetic resonance imaging, optical coherence tomography, acoustic emission and time- and space-resolved reflectance spectroscopy. The techniques are correlated to understan ...
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12
Participants partenaires
TERMINÉ
Lithography Enhancement towards Nano Scale (LENS)
Date du début: 1 janv. 2009, Date de fin: 1 déc. 2011,
Water immersion lithography has been widely accepted as patterning technology for the 45nm technology node, but solutions for the patterning of 32nm and 22nm technology nodes are not clear yet.EUV lithography is not yet available for industrial use, in spite of the impressive progresses registered till now, while multiple beam e beam lithography is still in development. Double patterning seems to ...
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