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5 projets européens trouvés

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 TERMINÉ 

Ultra-Low Power Event-Based Camera (ULPEC)

Date du début: 1 janv. 2017, Date de fin: 31 déc. 2020,

...integration in “systems of systemps” as well as the definition of upper power consumption limits depending on future application. The project consortium therefore includes an industrial end-user (Bosch), which will more particularly investigate autonomous and computer assisted driving. Autonomous and computer assisted driving are indeed a major disruption in the transport and car manufacturing sec ...
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 8

 TERMINÉ 

Making Big Data Small for the Internet of Things (Teraki)

Date du début: 1 juil. 2016, Date de fin: 31 déc. 2016,

...hanging force in the IoT sector. Founded in March 2015, we have already raised over 300,000€ in seed funding, and Teraki’s product-market fit is being validated by tier I companies like Audi, Bosch, Intel and Cisco IoT.
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 1

 TERMINÉ 

Mesleki Deneyimin Arttırılması ve Geliştirilmesi

Date du début: 1 sept. 2016, Date de fin: 31 oct. 2017,

...hers)3. Student mobility: 14 May 2017- 03 June 2017 Justus von Liebig Berufsschule - Germany (8 students -2 accompanying people)3. Teacher mobility: 14 May 2017- 27 May 2017 Carl Bosch Schule Heidelberg vocational education – Germany (2 teachers)d) Introduction Activitiese)Dissemination activitiesf)ReportResult: The students will gain behaviours such as European citizenship, respecting personal f ...
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 5

 TERMINÉ 

Ultra Wide Context Aware Imaging (PANORAMA)

Date du début: 1 janv. 2012, Date de fin: 1 déc. 2014,

In many application domains all over the world there is a trend from “single-view imaging” towards “multi-view imaging”. Some examples are the introduction of 3D/4D imaging in Healthcare, High Definition TV and beyond in Broadcasting, multiple connected Surveillance Cameras for monitoring a scene. These applications have in common that they all involve an explosive growth in the generation of imag ...
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 17

 TERMINÉ 
The proposed HERMES project wants to initiate a new mainstream packaging concept not bound by the existing supply chain, and by large-scale manufacturing technology. The project is aiming at further developing the concept of embedded thin chips into electronic boards, as a base for an integrated manufacturing of electronic circuits.The project consortium will develop a technology for embedding act ...
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