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20 projets européens trouvés

Recherche sur 125080 projets européens

 TERMINÉ 

Development of intensified water treatment concepts by integrating nano- and membrane technologies (Nametech)

Date du début: 1 juin 2009, Date de fin: 31 mai 2012,

...aromatic compounds or redox active metals, thus improving the water quality. A specific novelty is the development of an integrated permeate channel concept, whereby the nanoparticles are embedded in 3D textiles, functioning as membrane support and permeate channel. The nanoparticles will be deposited on the membrane surface or embedded in the membrane (mixed matrix). The S&T challenges regarding ...
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 11

 TERMINÉ 

Mobilnošću učenika i osoblja do novih kompetencija

Date du début: 1 sept. 2016, Date de fin: 31 août 2017,

... Congress held on the theme „Next standards in education for vocational school“ with a focus on metal education| mechanical engineering |sheet metal worker | water cutting | welding | milling | 3D printing |CNC |CAD/CAM | QM |steering techno". Acquired knowledge and skills include new didactic methods in class based on learning outcomes and the acquisition of new competences, and they will be use ...
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 4

 TERMINÉ 

Europejska mobilność uczniów i absolwentów Technikum Nowoczesnych Technologii w Kleszczowie - gwarancją sukcesu i kariery zawodowej.

Date du début: 1 sept. 2016, Date de fin: 30 juin 2018,

...objective of the project is the improvement of students’ competences in the field of designing and constructing devices with the use of modern computer programmes AutoCAD 2, AutoCAD 3D 2016, 2017 and Inventor 2016. By the implementation of the project our school strives to improve the participants’ knowledge and skills of foreign languages, including English in the scope of specialized vocabulary ...
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 2

 TERMINÉ 

Geometrical Product Specification and Verification as toolbox to meet up-to-date technical requirements

Date du début: 1 sept. 2015, Date de fin: 31 août 2018,

...dependency and other requirements (e.g. E, M, L, R, P, F), • general tolerances, complex geometrical features (threads, splines, gears), • roughness, waviness and primary profile (2D and 3D), • measurements with use of conventional measuring devices, measuring machines (especially CMMs), • measurements of form deviations and surface roughness, • measurements in micro- and nanoscale, • inspecti ...
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 9

 TERMINÉ 

Mobil beléptető kapu tervezése forgóajtóval

Date du début: 1 juil. 2015, Date de fin: 30 juin 2016,

...asis on the training of this specific job, furthermore to make it more attractive for the students wishing to enter higher education. Students start to get some insight and become familiar with the 3D engineering computer aided design programs during two lessons a week at grade 11. Design with AutoCAD and INVENTOR programs are taught at our school. The actual aim of the project is to make students ...
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 2

 TERMINÉ 

Zaawansowane umiejętności projektowania w Auto CAD

Date du début: 15 déc. 2014, Date de fin: 14 déc. 2015,

... Text and pattern in AutoCAD - Dimension drawing - Creating blocks and using them in projects - Creating and formatting texts - Creating technical objects i.e. hinge, lever, drive plate - Design of 3D parts - Derivation of 2D-drawings - Completion of parts to assemblies - Views and sections of parts and assemblies - Completing section assemblies - Designing objects (building, vase, chair, vehicl ...
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 2

 TERMINÉ 

Tároló rendszer tervezése notebookok számára egy CAD-program segítségével

Date du début: 1 sept. 2014, Date de fin: 31 août 2015,

...asis on the training of this specific job, furthermore to make it more attractive for the students wishing to enter higher education. Students start to get some insight and become familiar with the 3D engineering computer aided design programs during two lessons a week at grade 11. Design with AutoCAD and INVENTOR programs are taught at our school. The actual aim of the project is to make students ...
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 2

 TERMINÉ 

Formare profesionala in domeniul CAD si experienta de job shadowing in Mecatronica

Date du début: 1 sept. 2014, Date de fin: 31 août 2016,

... and Measuring Techniques and 5 students of twelfth level technological branch, CAD Technician specialization, level 3 qualification, which have undergone the practice in the field of 2D Design and 3D Modelling. The second target group was composed of 4 VET teachers who have completed a job shadowing in the field of mechatronics, mechanical design and production. The specific objectives for traine ...
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 3

 TERMINÉ 

Advanced laser ablation barrier films for organic and large area electronic devices (ALABO)

Date du début: 1 janv. 2015, Date de fin: 31 déc. 2017,

The overall objective of this project is developing organic electronic building elements on flexible substrates with monolithically integrated barrier foils as substrate. The barrier acts as the inevitable protection against atmospheric gases as water vapor and oxygen, as the most crucial agents for unwanted material degradation processes. This topic is one of the keys for enhancing both the perfo ...
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 7

 TERMINÉ 

Printed Logic for Applications of Screen Matrix Activation Systems (PLASMAS)

Date du début: 1 nov. 2013, Date de fin: 30 avr. 2017,

The EU has lost a significant share of the electronics manufacture sector to the Far East, resulting in a negative trade balance of >€100bn/year within this sector. This is (in part) due to the current manufacturing technologies that are based on subtractive processing that are expensive, wasteful and energy intensive, making manufacture in the EU economically and environmentally unfeasible. Print ...
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 11

 TERMINÉ 

Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

...d of assessing equipment for Key Enabling Technologies: SEA4KET concentrates on process and metrology systems for important enablers of future technologies: 450 mm wafer equipment, SiC material and 3D processing. The proposal comprises 15 sub-projects each dedicated to a specific equipment. The assessment activities were to a lesser extent chosen by "high S&T" excellence, but by their expected cha ...
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 26

 TERMINÉ 

The Development and Construction of a Master Mould for Riblet Construction (Riblet)

Date du début: 1 mars 2013, Date de fin: 30 sept. 2015,

The project will consist of the construction of a seamless, precision welded flat master mould manufactured to such a high quality to enable the embossing of painted riblets onto the outer surface of an aircraft. The riblets reduce significantly the drag characteristics under turbulent air flow. Each riblet is spaced 96µm apart and will achieve a sharp angular tip angle of 45 degrees. The depth of ...
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 5

 TERMINÉ 

Efficient, low-cost, stable tandem organic devices (X10D)

Date du début: 1 oct. 2011, Date de fin: 30 sept. 2014,

X10D aims to enable organic photovoltaics (OPV) to enter the competitive thin-film PV market. It will achieve this by pooling the knowledge and expertise of the leading research institutes and start-up companies in Europe, and is the first project of its kind to leverage this knowledge irrespective of the processing technology. It will use the strengths available in device efficiency and architect ...
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 20

 TERMINÉ 

Technology & Design Kits for Printed-Electronics (TDK4PE)

Date du début: 1 oct. 2011, Date de fin: 30 sept. 2014,

The goal of Technology & Design Kit for Printed Electronics (TDK4PE) is to set a fundamental change in the way printed electronics (PE) are designed and manufactured in Europe, with the aim of reducing costs and time-to-market by more than an order of magnitude for more complex designs than ever before by addressing thousands of transistors on a substrate.The key is to develop a methodology to ena ...
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 10

 TERMINÉ 

Printable, organic and large-area realisation of integrated circuits (POLARIC)

Date du début: 1 janv. 2010, Date de fin: 30 juin 2014,

The objective of the project is to realise high-performance organic electronic devices and circuits using large-area processing compatible fabrication methods. The high performance of the organic circuits referred to here means high speed (kHz-MHz range), low parasitic capacitance, low operating voltage, and low power consumption. The related organic thin film transistor (OTFT) fabrication develop ...
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 15

 TERMINÉ 

Innovation for Digital Fabrication (Diginova)

Date du début: 1 mars 2012, Date de fin: 28 févr. 2014,

Most products are produced by means of the established mass production infrastructure. Traditionally, this involves large stocks, high manual labor, large capital investments, high energy use, long distance transportation. Although many advanced new materials have unique functional properties that hold a great promise for innovation, they often need to meet the criteria and characteristics of this ...
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 22

 TERMINÉ 

Best-Reliable Ambient Intelligent Nano Sensor Systems (e-BRAINS)

Date du début: 1 sept. 2010, Date de fin: 28 févr. 2014,

...ficantly higher integration densities. Performance, multi-functionality and reliability of such complex heterogeneous systems will be limited mainly by the wiring between the subsystems. Suitable 3D integration technologies create a basis to overcome these drawbacks with the benefit of enabling minimal interconnection lengths. In addition to enabling high integration densities, 3D integration is a ...
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 20

 TERMINÉ 

Large Area Photonic Crystal Chemical Sensors (PHOTOSENS)

Date du début: 1 févr. 2011, Date de fin: 31 janv. 2014,

The PHOTOSENS project aims to develop a low-cost, mass-manufacturable, nano-structured, large-area multi-parameter sensor array using Photonic Crystal (PC) and enhanced Surface Enhanced Raman Scattering (SERS) methodologies for environmental and pharmaceutical applications. Integrating the PC and SERS based sensors with integrated optics coupling structures within a single sensor platform allows t ...
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 9

 TERMINÉ 

An innovative low-cost and flexible 3D scanning system (NavOScan)

Date du début: 1 nov. 2010, Date de fin: 31 juil. 2013,

...e important having high potential for a boost in this market. The accurate and easy creation of three dimensional images of real objects is achieved by sequential measured surface scans. Existing 3D white light scanners suffer from complex manual post-processing due to inaccurate measured data and technical limited number of surface scans. The goal is to create a system with remarkable advantages ...
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 9

 TERMINÉ 

Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test (ESIP)

Date du début: 1 mai 2010, Date de fin: 1 avr. 2013,

The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, th ...
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 40