10 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Ultra-Low PoweR technologIes and MEmory architectures for IoT (PRIME)
Date du début: 1 déc. 2015, Date de fin: 31 mars 2019,
The goal of the PRIME project is to establish an open Ultra Low Power (ULP) Technology Platform containing all necessary design and architecture blocks and components which could enable the European industry to increase and strengthen their competitive and leading eco-system and benefit from market opportunities created by the Internet of Things (IoT) revolution. Over 3 years the project will deve ...
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19
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TERMINÉ
Technology CAD for III-V Semiconductor-based MOSFETs (III-V-MOS)
Date du début: 1 nov. 2013, Date de fin: 30 avr. 2017,
...bstantially reducing the options to be explored for the device design and the corresponding costs. Future exploitation and high impact of the project results are guaranteed by the TCAD market leader (Synopsys); by a SME specialized in the growing business of atomistic simulations for technology development (QuantumWise); by a research center (IMEC) and an industry lab (IBM) engaged in CMOS fabrica ...
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11
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TERMINÉ
From atom-to-Device Explicit simulation Environment for Photonics and Electronics Nanostructures (DEEPEN)
Date du début: 1 janv. 2014, Date de fin: 31 déc. 2016,
...al input from PDI also critical for validation of the multiscale models developed. Industry partners include a key multiscale modelling system provider (TiberLAB), a leading TCAD simulation provider (Synopsys) and an industrial end-user (Osram) who provide experimental validation and test the simulation environment for device design and investigation. Future code distribution will be supported thr ...
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6
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TERMINÉ
Energy Efficient Converters using GaN Power Devices (E2COGAN)
Date du début: 1 avr. 2013, Date de fin: 31 mars 2016,
The E2COGaN project will target the demonstration of GaN-on-Si as a disruptive power device technology platform through the whole value chain up to demonstrators with high industrial, societal and environmental relevance. Its innovative character will be proven through a well-balanced and application specific trade-off between the “corner” benefits given by higher efficiency, higher switching freq ...
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25
Participants partenaires
TERMINÉ
Advanced Avionic Applications Simulation Platform (AAASP)
Date du début: 28 août 2013, Date de fin: 27 août 2015,
"The objective of the project is to develop a set of models, libraries, scripts and test circuits to enable the complete analysis of the Aircraft Power System at equipment and electrical network level. To achieve this objective the concept of an “Advanced Avionic Application Simulation Platform” (AAASP) will be introduced which is based on the SaberRD simulator.Key features of AAASP are:- Generic ...
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2
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TERMINÉ
Verification and Testing to Support Functional Safety Standards (VeTeSS)
Date du début: 1 mai 2012, Date de fin: 30 avr. 2015,
New safety standards, such as ISO 26262, present a challenge for companies producing safety-relevant embedded systems. Safety verification today is often ad-hoc and manual; it is done differently for digital and analogue, hardware and software.The VeTeSS project will develop standardized tools and methods for verification of the robustness of safety-relevant systems, particularly against transient ...
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26
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TERMINÉ
Advanced TEchnology MOdelling for eXtra-functionality devices (ATEMOX)
Date du début: 1 juil. 2010, Date de fin: 30 nov. 2013,
...he development of devices for which Europe is still at the forefront. The Atemox project will develop the full set of missing models and implement and include them into the Sentaurus TCAD platform of Synopsys so that they are of immediate value to the European semiconductor industry. The integrated models will finally be evaluated by STMicroelectronics with respect to industrial needs. To reach th ...
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14
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TERMINÉ
Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future (THERMINATOR)
Date du début: 1 janv. 2010, Date de fin: 31 déc. 2012,
Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and ...
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21
Participants partenaires
TERMINÉ
Silicon-based nanostructures and nanodevices for long term nanoelectronics applications (NANOSIL)
Date du début: 1 janv. 2008, Date de fin: 31 mars 2011,
NANOSIL Network of Excellence aims to integrate at the European level the excellent European research laboratories and capabilities in order to strengthen scientific and technological excellence in the field of nanoelectronic materials and devices for terascale integrated circuits (ICs) and disseminate the results in a wide scientific and industrial community.NANOSIL will explore and assess the sc ...
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38
Participants partenaires
TERMINÉ
MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)
Date du début: 1 janv. 2008, Date de fin: 31 déc. 2010,
Description
MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all ...
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