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5 projets européens trouvés

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 TERMINÉ 

EnerTwin: A different approach to micro CHP (EnerTwin)

Date du début: 1 mars 2016, Date de fin: 28 févr. 2018,

Micro Combined Heat and Power (mCHP) systems are a perfect addition to stabilize the electricity grid in the increased presence of volatile renewable sources. Due to their efficient generation and local use of heat and electricity, their fuel saving- and CO2 reduction potential is tremendous. In spite of great interest of the market and policy-makers, currently available mCHP systems suffer from l ...
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 5

 TERMINÉ 
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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 32

 TERMINÉ 

Advanced Reluctance Motors for Electric Vehicle Applications (ARMEVA)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

To enable a large scale adoption of EVs, a new generation of electric drive systems is needed to reduce dependency on rare earth materials, while improving energy efficiency, power density, safe operation and reducing manufacturing/recycling costs. ARMEVA will develop a new rare-earth-material free generation of advanced reluctance motors.The goal of ARMEVA is to achieve similar power density and ...
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 8

 TERMINÉ 

European 450mm Equipment Demo Line (E450EDL)

Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,

The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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 44

 TERMINÉ 

Enable power technologies on 300mm wafer diameter (EPT300)

Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,

EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore manufacturing capabilities relating to energy efficient electronic solutions. Power semiconductor devices fabricated in a European leading pilot line for 300mm wafer production are the scope of the project, for which manufacturing excellence, cost competitivene ...
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 22