9 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
High Performance Laser-based Additive Manufacturing (HIPERLAM)
Date du début: 1 nov. 2016, Date de fin: 31 oct. 2019,
HIPERLAM is an SME driven Research and Innovation Action (RIA) well-aligned to the Factories of the Future (FoF) Initiative with a strong emphasis upon demonstrating superior cost and speed performance in end-to-end processes featuring laser-based additive manufacturing in two key applications requiring high resolution printed conductive metallic lines, namely laser printed RFID antenna and laser ...
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8
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TERMINÉ
Innovative High Resolution Electro-Static printing of Multifunctional Materials. (Hi-Response)
Date du début: 1 mars 2015, Date de fin: 31 août 2018,
The EU is well placed to exploit printed electronic technologies to create greater economic and social benefits for the EU, but only if we are able to commercialise innovative technologies created within the EU.Ink jet printing technologies are at the forefront of printed electronic developments. However, Ink jet printing has only been able to achieve a resolution of >=10um and the viscosity of pr ...
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14
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TERMINÉ
Large Organic Robust Imager for X-ray sensing (LORIX)
Date du début: 1 févr. 2015, Date de fin: 31 juil. 2018,
General X-ray image sensing is undergoing a major transition away from analog solutions towards Direct Radiography using digital Flat-Panel Detector (FPD) technology, offering immediate imaging, large productivity, lower dose and portability. LORIX will develop, prototype and demonstrate large area X-ray FPD detectors enabled by TOLAE technology by combining a printed Organic Photo Diode (OPD) wit ...
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12
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TERMINÉ
Reengineering and Enabling Performance And poweR of Applications (REPARA)
Date du début: 1 sept. 2013, Date de fin: 31 août 2016,
In recent years, traditional processors have not been able to translate the advances of silicon fabrication technology into corresponding performance gains. This has been due to weaknesses inherent in the current sequential programming model, which has not changed significantly since the late 1940's, as well as due to physical constraints, such as practical limits on the energy consumption and the ...
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9
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TERMINÉ
Pilot-scale hybrid roll to roll/sheet to sheet manufacturing chain for flexible OLEDs (Flex-o-Fab)
Date du début: 1 oct. 2012, Date de fin: 30 sept. 2015,
Organic Electroluminescence (OLED) is the most promising technology to deliver flexible, thin, light weight, power efficient and environment-friendly light sources. Currently glass based OLED devices are slowly entering the market place, opening new possibilities for lighting solutions. By adding flexibility and robustness at a lower price point, flexible OLEDs will change the lighting industry an ...
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14
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TERMINÉ
Contamination and defect control for increased yield for large scale R2R production of OPV and OLED (CLEAN4YIELD)
Date du début: 1 mai 2012, Date de fin: 30 avr. 2015,
While nanotechnology was originally limited to small areas of a few cm2, the quest for lower costs has been the latest years the drive for developing processes utilising larger substrate sizes at increasing throughputs. A typical example is the flat panel display industry where the push to larger gen size and faster processing has resulted in a significant cost reduction. The next challenge here i ...
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18
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TERMINÉ
Heterogeneous integration of autonomous smart films based on electrochromic transistors (SMART-EC)
Date du début: 1 sept. 2010, Date de fin: 31 août 2014,
SMART-EC aims at the development of self powered (energy harvesting and storage) EC device integrating EC thin film transistor component on a flexible substrate for energy saving, comfort and security in automotive, e-cards and smart packaging sectors.The objective is to overcome the current limitations related to low switching time and manufacturing costs; the switching time can be reduced (<1 ...
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13
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TERMINÉ
Ultra thin chip integration process for low cost communicative polymer foils (Chip2Foil)
Date du début: 1 janv. 2010, Date de fin: 30 avr. 2013,
Chip2Foil aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a high volume, reel-to-reel production concept. This competence allows realising a broad variety of disposable communicative packages. These packages provide increased interaction between the packed product, the package and the user through near-field communicat ...
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8
Participants partenaires
TERMINÉ
High-throughput, large area and cost-effective OLED production technologies (Fast2Light)
Date du début: 1 févr. 2008, Date de fin: 31 juil. 2011,
Organic electroluminescence (OLED) holds the promise to deliver flexible, thin, lightweight and power-efficient light sources. Research up until now has been mainly motivated by work on glass-based displays, where the aspects of increased contrast, high viewing angle and response speed are critical. However, intelligent lighting applications are becoming increasingly relevant; here, the unique pro ...
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