8 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs (INTEGRATE)
Date du début: 1 janv. 2013, Date de fin: 31 déc. 2015,
European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and product diversity. The project aims at conducting research to support the development of new manufacturing procedures, new organizations and new information and control tools to enable IC production lines to efficiently manage a high product and technology mix and ...
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29
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TERMINÉ
SYnthesis and functionality of chalcogenide NAnostructures for PhaSE change memories (SYNAPSE)
Date du début: 1 déc. 2012, Date de fin: 30 nov. 2015,
The SYNAPSE project initially aimed at the metalorganic chemical vapor phase deposition (MOCVD) and study of chalcogenide single material, (core) and double material (core-shell) nanowires (NWs), for innovative multi-level phase change memories (PCM). If Ge-Sb-Te is the most studied material for PCM applications, In-based materials, like In-Sb-Te or In-Ge-Te alloys, are also promising, since they ...
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7
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TERMINÉ
Interactive Devices for Efficiency in Automotive with Increased Reliability and Safety (IDEAS)
Date du début: 1 juin 2012, Date de fin: 1 mai 2015,
The overall objective of IDEAS “Interactive Power Devices for Efficiency in Automotive with Increased Reliability and Safety”, - is to develop advanced packaging for power supply components and new generation memory systems having application on Electric and ICE propelled vehicles and aiming at covering complementary aspects which haven’t yet addressed into the main running ENIAC and ARTEMIS Aut ...
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15
Participants partenaires
TERMINÉ
Semiconductor Industry Leading towards Viable Energy Recovery (SILVER)
Date du début: 1 janv. 2012, Date de fin: 1 déc. 2014,
There is no doubt that ICT, supported by semiconductor technology, can play in using more efficiently energy resources and in allowing the adoption of renewable energy production, care must be taken that the complete life cycle of the envisaged technologies is considered, and that also the energy costs for the production of the critical semiconductor components are minimized. This concept applies ...
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14
Participants partenaires
TERMINÉ
Agile RF Transceivers and Front-Ends for Future Smart Multi-Standard Communications Applications (ARTEMOS)
Date du début: 1 avr. 2011, Date de fin: 1 mars 2014,
This project aims at developing architecture and technologies for implementing agile radio frequency (RF) transceiver capacities in future radio communication products. These new architecture and technologies will be able to manage multi-standard (multi-band, multi-data-rate, and multi-waveform) operation with high modularity, low-power consumption, high reliability, high integration, low costs, l ...
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41
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TERMINÉ
Secure Memories and Applications Related Technologies (SMART)
Date du début: 1 janv. 2010, Date de fin: 1 déc. 2013,
SMART Secure memories and applications-related technologies Growth in digital multimedia and in wired and wireless Internet- based services focuses attention on the need for protection of personal data and identification. Various electronic certification devices have been used – from magnetic-strip cards to increasingly sophisticated smart cards. Convergence of applications such as personal or pri ...
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14
Participants partenaires
TERMINÉ
Trusted Computing for European Embedded devices (TOISE)
Date du début: 1 janv. 2011, Date de fin: 1 déc. 2013,
...iative is proposed to align a common European position in the area. This will be actually a effort from major European semiconductor, fables and foundry players (Austriamicrosystems, Atmel, Infineon, Numonyx, NXP and STMicroelectronics), four IP providers (Intrinsic-ID, Magillem, Secure IC, Virage Logic) for PUF and secure IP infrastructure, two SME experts in Security solutions or evaluation labs ...
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19
Participants partenaires
TERMINÉ
Lithography Enhancement towards Nano Scale (LENS)
Date du début: 1 janv. 2009, Date de fin: 1 déc. 2011,
Water immersion lithography has been widely accepted as patterning technology for the 45nm technology node, but solutions for the patterning of 32nm and 22nm technology nodes are not clear yet.EUV lithography is not yet available for industrial use, in spite of the impressive progresses registered till now, while multiple beam e beam lithography is still in development. Double patterning seems to ...
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