9 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
From Measurements to Standardized Multi-Domain Compact Models of LEDs (DELPHI4LED)
Date du début: 1 juin 2016, Date de fin: 31 mai 2019,
The European lighting industry aims at reducing cost, at continuously improving product performance while reducing time to market and enlarging the product. The main challenge for the design in of LED components into lighting systems is the temperature and current dependence of their performance. In order to achieve a good design of LED systems, a modular, multi-physics based modelling approach is ...
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15
Participants partenaires
TERMINÉ
THINGS2DO (THINGS2D0)
Date du début: 1 janv. 2014, Date de fin: 1 janv. 2018,
Develop the FDSOI ecosystem in Europe, beyond the PLACES2BE Pilot Line, in order to increase the impact of this European technology. At the time of set up of the first KET pilot line the proof of FDSOI was mainly technological. In between then and now, the first realization of a complex silicon chip in FDSOI has shown to the worldwide microelectronics community the capabilities of this technology. ...
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44
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TERMINÉ
Analog SImulation and Variability Analysis for 14nm designs (ASIVA14)
Date du début: 1 sept. 2013, Date de fin: 31 août 2017,
"In recent years the demand of the electronics industry on mathematical methods used in EDA software has witnessed a tremendous growth. “The real world is analog and computers are digital.” These nine words set the stage for the great circuit design challenges of the next decade. To quote G. Dan Hutchenson, president of VLSI Research, “virtual reality is possible only with mixed-signal chips, and ...
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2
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TERMINÉ
Photonic Libraries And Technology for Manufacturing (PLAT4M)
Date du début: 1 oct. 2012, Date de fin: 31 mars 2017,
Description
"PLAT4M will make silicon photonics ready for transition to industry"Silicon is now a mature integration platform that has brought CMOS microelectronics to mass-market application. The PLAT4M vision is that silicon photonics will lead to a similar revolution in the photonics sector.Over the past years silicon photonics has see ...
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18
Participants partenaires
TERMINÉ
Pilot Line For Self Assembly Copolymer Delivery (PLACYD)
Date du début: 1 janv. 2014, Date de fin: 1 janv. 2017,
The PLACYD project aims at strengthening the European leadership in the field of advanced lithography. The consortiums gathers the main European Rnull actors along the whole value chain (Material suppliers, equipment suppliers, semiconductor companies, CAD companies, research laboratories) in order to bring the key materials, processes and design tools for Directed Self Assembly (DSA) Lithography ...
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11
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TERMINÉ
Pilot Lines for Advanced CMOS EmbodimentS in 2x nodes, Built in Europe (PLACES2BE)
Date du début: 3 déc. 2012, Date de fin: 31 déc. 2015,
...tegral part of the Horizon 2020 strategy.Consortium: PLACES2BE Pilot line gathers 27 experienced partners, including industry leaders such as GLOBALFOUNDRIES, ARM, STEricsson, SOITEC, MENTOR Graphics along the microelectronics value chain, SMEs such as Open Engineering, eSilicon, GSS, Axiom, IBS, RTOs such as the Fraunhoger Gesellschaft, IMEC, and LETI, and several academic teams located in 8 Euro ...
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22
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TERMINÉ
Lithography Enhancement towards Nano Scale (LENS)
Date du début: 1 janv. 2009, Date de fin: 1 déc. 2011,
Water immersion lithography has been widely accepted as patterning technology for the 45nm technology node, but solutions for the patterning of 32nm and 22nm technology nodes are not clear yet.EUV lithography is not yet available for industrial use, in spite of the impressive progresses registered till now, while multiple beam e beam lithography is still in development. Double patterning seems to ...
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12
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TERMINÉ
Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)
Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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17
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TERMINÉ
Advancing Traffic Efficiency and Safety through Software Technology phase 2 (ATESST2)
Date du début: 1 juil. 2008, Date de fin: 30 juin 2010,
Advanced automotive functions are increasingly dependent on software and electronics. The complexity and criticality of automotive embedded systems already constitute an inhibiting factor for further evolution of functionality. This is evident for single automotive systems and even more so for functions that interact between vehicles and between vehicle and infrastructure, cooperative systems. New ...
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