3 projets européens trouvés
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TERMINÉ
Semiconductor Equipment Assessment Leveraging Innovation (SEAL)
Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,
Description
Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry.
SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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39
Participants partenaires
TERMINÉ
Wavelength Division Multiplexed Photonic Layer on CMOS (WADIMOS)
Date du début: 1 janv. 2008, Date de fin: 30 juin 2011,
WADIMOS proposes to develop a generic technology for the realization of complex electro-photonic integrated ICs using standard CMOS processing technologies.These ICs will contain a photonic interconnect layer incorporating microsource arrays and ultracompact WDM (wavelength division multiplexing) functionality based on silicon nanophotonic wire circuits, driven directly from by the CMOS electronic ...
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8
Participants partenaires
TERMINÉ
MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)
Date du début: 1 janv. 2008, Date de fin: 31 déc. 2010,
...e overall cost of ownership of this technique. This trend opens opportunity for the Mask-Less Lithography (ML2) technology, based on multi-beam principles and developped by the two European companies MAPPER and IMS Nanofabrication AG. The cost effective model of the ML2 option in association with the high resolution capability of the electron beam lithography and a reasonable throughput target rep ...
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