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9 projets européens trouvés

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 TERMINÉ 

Seven Nanometer Technology (SeNaTe)

Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,

The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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 41

 TERMINÉ 

Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)

Date du début: 1 mai 2015, Date de fin: 30 avr. 2017,

The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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 32

 TERMINÉ 

Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)

Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,

SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D to equipment assessment experiments. The strategic objective is to effectively combine resources and expertise in a joint assessment of novel equipment for key enabling technologies to foster and accelerate the successful transfer of novel European equipment in ...
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 26

 TERMINÉ 

European 450mm Equipment Demo Line (E450EDL)

Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,

The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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 44

 TERMINÉ 

Safe Adaptive Software for Fully Electric Vehicles (SafeAdapt)

Date du début: 1 juil. 2013, Date de fin: 30 juin 2016,

The promising advent of fully electric vehicles also means a shift towards fully electrical control of the existing and new vehicle functions. In particular, critical X-by-wire functions require sophisticated redundancy solutions. As a result, the overall Electric/Electronic (E/E) architecture of a vehicle is becoming even more complex and costly.The main idea of SafeAdapt is to develop novel arch ...
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 10

 TERMINÉ 

European E&M 450mm Pilotline Readiness (EEM450PR)

Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,

Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
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 32

 TERMINÉ 

Enable power technologies on 300mm wafer diameter (EPT300)

Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,

EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore manufacturing capabilities relating to energy efficient electronic solutions. Power semiconductor devices fabricated in a European leading pilot line for 300mm wafer production are the scope of the project, for which manufacturing excellence, cost competitivene ...
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 22

 TERMINÉ 

Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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 39

 TERMINÉ 

Copper Interconnects for Advanced Performance and Reliability (CopPeR)

Date du début: 1 janv. 2008, Date de fin: 30 nov. 2010,

The CopPeR project will provide a novel copper deposition process based on the useof non-aqueous solvents to overcome the limitations of currently employedinterconnect formation processes enabling device scaling beyond the 32 nmtechnology node. This non-aqueous process will open novel routes to implementdirect on barrier plating, focussing on tantalum and ruthenium as diffusion barriers.As another ...
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 8