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11 projets européens trouvés

Recherche sur 125080 projets européens

 TERMINÉ 

Smart Sensor Technologies and Training for Radiation Enhanced Applications andMeasurements (STREAM)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2019,

STREAM is a 4-year multi-site training network that aims at career development of Early Stage Researchers (ESRs) on scientific design, construction manufacturing and of advanced radiation instrumentation. STREAM targets the development of innovative radiation-hard, smart CMOS sensor technologies for scientific and industrial applications. The platform technology developed within the project will b ...
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 11

 TERMINÉ 

3D Advanced Metrology and materials for advanced devices (3DAM)

Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,

The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges w ...
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 18

 TERMINÉ 

Technology Advances and Key Enablers for 5 nm (TAKE5)

Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,

The TAKE5 project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 10nm technology node and the ECSEL JU project SeNaTe aiming at the 7nm technology node. The main objective of the TAKE5 project is the demonstration of 5nm patterning in line with the industry needs and the ITRS roadmap in the Advanced Patter ...
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 13

 TERMINÉ 

"Sources, Interaction with Matter, Detection and Analysis of Low Energy Electrons 2" (SIMDALEE2)

Date du début: 1 sept. 2014, Date de fin: 31 août 2018,

"The purpose of the SIMDALEE2 (Sources, Interaction with Matter, Detection and Analysis of Low Energy Electrons) network is to establish a world-class research training platform for the science and technology of nanoscale manipulation and analysis using low energy electrons. Apart from an effective and well-structured training programme, the network will pursue the following scientific goals: (1) ...
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 12

 TERMINÉ 

Seven Nanometer Technology (SeNaTe)

Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,

The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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 41

 TERMINÉ 

Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)

Date du début: 1 mai 2015, Date de fin: 30 avr. 2017,

The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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 32

 TERMINÉ 

European 450mm Equipment Demo Line (E450EDL)

Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,

The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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 44

 TERMINÉ 

European E&M 450mm Pilotline Readiness (EEM450PR)

Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,

Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
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 32

 TERMINÉ 

High-throughput Production of FunctIonal 3D images of the brain (HIGH PROFILE)

Date du début: 1 avr. 2011, Date de fin: 30 juin 2014,

"HIGH PROFILE combines industrial and clinical driven R&D activities dealing with image diagnostic platforms for the central nervous system. The project’s approach is to progress state-of-the-art by integrating imaging equipment for diagnostics –including algorithms, equipment and infrastructure for massive image processing and simulation– to support combinations of images from different medical e ...
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 20

 TERMINÉ 

Joint Equipment and Materials for System-in-Package and 3D-Integration (JEMSIP_3D)

Date du début: 1 avr. 2009, Date de fin: 1 mars 2012,

The objective of the project « Joint Equipment & Materials for System-in-Package and 3D Integration » is to validate technological solutions for the fabrication of high value-added heterogeneous components and systems.This theme, generally known as “More Than Moore”, intends to gather within a unique system a set of various functions, implemented with elementary components, those generally being f ...
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 20

 TERMINÉ 

Lithography Enhancement towards Nano Scale (LENS)

Date du début: 1 janv. 2009, Date de fin: 1 déc. 2011,

Water immersion lithography has been widely accepted as patterning technology for the 45nm technology node, but solutions for the patterning of 32nm and 22nm technology nodes are not clear yet.EUV lithography is not yet available for industrial use, in spite of the impressive progresses registered till now, while multiple beam e beam lithography is still in development. Double patterning seems to ...
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 12