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 TERMINÉ 

Wafer scale Integration of Photonics and Electronics (WIPE)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2018,

The WIPE project aims at developing hybrid electronic-photonic chips as a key enabling technology for data transmission purposes. It aims at bringing photonics to a new level by developing a concept that can be well industrialised. This sustains EU leadership in photonics, as is the ambition of the work program. A new wafer-scale technology will thus be developed for direct and intimate attachme ...
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 TERMINÉ 

Photonic Integrated Circuits Accessible to Everyone (PICs4All)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2018,

The prime objective of PICs4All is to increase the impact of photonics and enable access to the advanced photonic integrated circuit (PIC) technologies for academia, research institutes, SMEs and larger companies. This will be achieved by establishing a European network of Application Support Centres (ASCs) in the field of PIC technology. The main task of the ASCs is to lower the barrier to Resear ...
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 TERMINÉ 
ManSYS aims to develop and demonstrate a set of e-supply chain tools; to enable the mass adoption of Additive Manufacturing (AM). This will allow businesses to identify and determine the suitability of AM for metal products, and subsequently manage the associated supply-chain issues and ‘facilitating’ open product evolution.The proposed e-supply chain solution will combine all aspects of AM includ ...
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 13

 TERMINÉ 
The proposal offers a solution for the growing quantity of product types on the market requiring enormous warehouses to keep stock for spare parts, with corresponding high costs and complex logistics. This emerging problem is caused by the continuously decreasing product life time, decreasing time-to-market and increasing regulatory affairs. A solution is foreseen using Rapid Manufacturing (RM) ...
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