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Enable power technologies on 300mm wafer diameter (EPT300)
Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,
EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore manufacturing capabilities relating to energy efficient electronic solutions. Power semiconductor devices fabricated in a European leading pilot line for 300mm wafer production are the scope of the project, for which manufacturing excellence, cost competitivene ...
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