10 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Coordination Action to enable an effective European 450 mm Equipment & Materials Network (ENABLE450)
Date du début: 1 nov. 2012, Date de fin: 31 oct. 2016,
5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently ordering and installing the first wave of 450 mm systems. The major drivers of this effort are Intel and TSMC, which have provide ...
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13
Participants partenaires
TERMINÉ
Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D to equipment assessment experiments. The strategic objective is to effectively combine resources and expertise in a joint assessment of novel equipment for key enabling technologies to foster and accelerate the successful transfer of novel European equipment in ...
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26
Participants partenaires
TERMINÉ
Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide (Bridge450)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor processing and are now installing the first wave of 450mm prototype systems. Intel and TSMC lead this effort with published roadmaps showing pilot lines in 2016, production in 2018. Samsung will soon follow which will force GlobalFoundries, SK Hynix, Toshiba, UM ...
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12
Participants partenaires
TERMINÉ
Integrated Solutions for Agile Manufacturing in High-mix Semiconductor Fabs (INTEGRATE)
Date du début: 1 janv. 2013, Date de fin: 31 déc. 2015,
European IC manufacturers are on the way to become suppliers of customized products for OEM companies, which means high flexibility and product diversity. The project aims at conducting research to support the development of new manufacturing procedures, new organizations and new information and control tools to enable IC production lines to efficiently manage a high product and technology mix and ...
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29
Participants partenaires
TERMINÉ
European E&M 450mm Pilotline Readiness (EEM450PR)
Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,
Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
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32
Participants partenaires
TERMINÉ
Enable power technologies on 300mm wafer diameter (EPT300)
Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,
EPT 300 aims to be a decisive step forward to strengthen Europe’s leading position in power semiconductor technologies and More-than-Moore manufacturing capabilities relating to energy efficient electronic solutions. Power semiconductor devices fabricated in a European leading pilot line for 300mm wafer production are the scope of the project, for which manufacturing excellence, cost competitivene ...
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22
Participants partenaires
TERMINÉ
European 450mm Equipment & Materials Initiative (EEMI 450)
Date du début: 1 avr. 2010, Date de fin: 1 mars 2013,
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
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27
Participants partenaires
TERMINÉ
High density integration by embedding chips for reduced size modules and electronic systems (HERMES)
Date du début: 1 mai 2008, Date de fin: 29 févr. 2012,
The proposed HERMES project wants to initiate a new mainstream packaging concept not bound by the existing supply chain, and by large-scale manufacturing technology. The project is aiming at further developing the concept of embedded thin chips into electronic boards, as a base for an integrated manufacturing of electronic circuits.The project consortium will develop a technology for embedding act ...
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14
Participants partenaires
TERMINÉ
Gigascale Oriented Solid State flAsh Memory for EuRope (GOSSAMER)
Date du début: 1 janv. 2008, Date de fin: 30 juin 2011,
Description
GOSSAMER successfully developed a fully integrated Flash NAND technology based on the TANOS concept, investigating a large number of architecture and material options.
The project aimed at the development of the technology for very high density Non Volatile Memories for mass storage ap ...
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21
Participants partenaires
TERMINÉ
The cultural differences through creative photogra
Date du début: 1 mars 2014,
The youth exchange aims to gather young creative people from Scotland, Spain, Armenia, Georgia, Turkey, Moldova, who will show the similarities and differences of their cultures through photography. The project will be host by an Armenian organization. The project venue is Alaverdi, Armenia. We are planning to hold the project on 26th of May until 2nd of June, 2014. We choose Alaverdi because it i ...
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