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Multi-scale Formation of Functional Nanocrystal-Molecule Assemblies and Architectures (FUNMOL)
Date du début: 1 oct. 2008, Date de fin: 31 mars 2012 PROJET  TERMINÉ 

Recent developments in the design and synthesis of nanoscale building blocks as active elements in opto- or bio-electronic devices with tailored electronic functionality have the potential to open up new horizons in nanoscience and also revolutionise multi-billion dollar markets across multiple technology sectors including healthcare, printable electronics, and security. Ligand-stabilised inorganic nanocrystals (~2-30 nm core diameters) and functional organic molecules are attractive building blocks due to their size dependent opto-electronic properties, the availability of low-cost synthesis processes and the potential for formation of ordered structures via (bio) molecular recognition and self-assembly. Harnessing the complementary properties of both nanocrystals and functional molecules thus represents a unique opportunity for generation of new knowledge and development of new classes of high knowledge-content materials with specific functionality tailored for key applications, e.g., printable electronics, biosensing or energy conversion in the medium term, and radically new information and signal processing paradigms in the long term. Self-assembly and self-organisation processes offer the potential to achieve dimensional control of novel multifunctional materials at length scales not accessible to conventional “top-down” technologies based on lithography. It is critical for European industry to develop new knowledge and low-cost, scaleable processes for assembly and electrical interfacing of these multifunctional materials with conventional contact electrodes in order to produce into tailored devices and products, in particular on low-cost substrates. The FUNMOL consortium will deliver substantial innovation to European industry via development of cost-effective, scaleable processes for directed assembly of high-knowledge content nanocrystal-molecule materials into electrically-interfaced devices at silicon oxide, glass and plastic substrates.



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