New multi-beam Tera-scale capacity satellites will require a disruptive approach to address digital on-board processors that rely on electronics which consume space, power and cost and reach their capacity saturation. The disruptive solution must combine scalability, technical feasibility, power-efficiency and cost-effectiveness. ROBIN aims to provide this solution realizing multi-gigabit optical inter-connectivity with a unique combination of low-power and high-bandwidth multimode (MM) GaAs VCSEL/PDs, low power, radiation-hardened BiCMOS drivers and radiation-hardened multi-core fibers (MCFs). ROBIN will integrate these technologies on a space grade photonic integration capable to provide ruggedized transceiver modules with a record-high 150Gb/s throughput and 6mW/ Gb/s energy consumption which is a 3-fold improvement against state-of-the-art (SOTA) US-based products. ROBIN will fabricate the first >15GHz MCF-matched 850nm VCSELs operating at -40 to +100 oC and will drive energy consumption down to <200 fJ/bit (0.2 mW/Gb/s). ROBIN will demonstrate the first >30 GHz MM MCF-PDs with >0.6A/W responsivity. ROBIN will couple MCF-VCSELs/PDs to the first 6-core radiation-hard MM-MCF to offer the capability for single-feedthrough robust and hermetic module packaging. Fibers will be distributed through a monolithic fan-out avoiding the use and procurement of expensive connectors. ROBIN will develop the first 25 Gb/s 6-channel, driver/TIA ICs with record-low <2pJ/bit energy consumption in a 5-fold decrease against SOTA products. ICs will be fabricated with IHP 0.25μm SiGe BiCMOS process which is under ESA qualification. ROBIN will fabricate an opto-electronic 6x25 Gb/s capable ADC/DAC module using MCF optical interfaces and will test it in a full-scale optical interconnect breadboard demonstrator. Finally, ROBIN will perform space assessment tests on all the components to align development towards a European space qualifiable system.