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Zero- and First-level Packaging of RF-MEMS (MEMSPACK)
Date du début: 1 juin 2008, Date de fin: 29 févr. 2012,
...-ends, featuring small size, low weight, high performance and low cost. Off-chip, bulky passive RF components, like discrete PIN diode switches and ceramic filters, are limiting further chip scaling. MEMS technology is now rapidly emerging as an enabling technology to yield a new generation of high-performance RF-MEMS passives, like switches, high-Q resonators and tunable filters.Today, the commer ...
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