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Platform for European CMOS Imagers - EUROCIS (EuroCIS)

Date du début: 1 nov. 2011, Date de fin: 31 oct. 2014,

...e area (much larger than commercial imagers) high sensitivity imagers will be developed using stitching technology and backside thinning. A key element here is the backside passivation process using laser annealing.The outcome of this project is a CMOS imager design and manufacturing platform that can be used by the space industry (ESA, CNES, satellite manufacturers, ... ) for their future space ...
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