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 TERMINÉ 

HIRF Synthetic Environment (HIRF SE)

Date du début: 1 déc. 2008, Date de fin: 31 mai 2013,

"The HIRF SE research project has the goal of providing the aeronautics industry with a framework which can be used during the development phase to mitigate the EM aspects. In addition it will provide a considerable reduction in the certification/qualification tests required on air vehicle. The HIRF SE main objectives can be summarized by the two followings items: • Full validated and integrated s ...
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 TERMINÉ 

Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)

Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,

One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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