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 TERMINÉ 
SusPIRE project assimilates in its conception the sustainable energy use challenge described in the European SETPLAN and in SPIRE road map. It addresses its efforts to energy intensive industries and within this segment market to energy recovery from residual heat streams. To achieve this goal a two clearly differentiated working areas will be key aspects of this project. Technology area will in ...
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 9

 TERMINÉ 
Background Construction is the largest industrial sector employer in the EU. The “cradle to grave” aspects linked with the creation, use and disposal of buildings, however, create major environmental problems. Construction activities consume more raw materials than any other industrial sector; and as a result also account for the largest share of gree ...
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 4

 TERMINÉ 

Silicon sUbstrates from an inteGrated Automated pRocess (SUGAR)

Date du début: 1 oct. 2010, Date de fin: 30 sept. 2013,

...f the ultra-thin solar wafers, a material, for instance a metallic material, with a high coefficient of thermal expansion, is deposited on the substrate at high temperature. The system is then cooled down, and the difference of thermal expansion induces some stress in the silicon substrate. When the stress exceeds the mechanical strength of silicon, a crack propagates parallel to the surface, and ...
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 11

 TERMINÉ 

New Si-based halogen-free Flame Retardants for Greener plastics (FR GreenSi)

Date du début: 31 mars 2011, Date de fin: 30 mars 2013,

...zed flame retardant solutions to varied polymer matrices, meeting the needs of many industries and markets requirements and safety regulations. This fellowship will facilitate the interaction between Dow Corning Europe and Lille Faculty of Sciences.The aim, besides personal development, is the combination of the major strengths of this trio fellow-company-university in terms of synthesis and organ ...
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 1

 TERMINÉ 

MAsk less lithoGraphy for IC manufacturing (MAGIC) (MAGIC)

Date du début: 1 janv. 2008, Date de fin: 31 déc. 2010,

Description MAGIC has supported the development of e-beam based maskless lithography technology in Europe: Two parallel lithography tool developments for 32nm CMOS and beyond and on lithography infrastructure.In the CMOS manufacturing environment, the mask-based optical lithography technique is up to now driving solution to deal with all ...
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