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Joint Equipment and Materials for System-in-Package and 3D-Integration (JEMSIP_3D)
Date du début: 1 avr. 2009, Date de fin: 1 mars 2012,
The objective of the project « Joint Equipment & Materials for System-in-Package and 3D Integration » is to validate technological solutions for the fabrication of high value-added heterogeneous components and systems.This theme, generally known as “More Than Moore”, intends to gather within a unique system a set of various functions, implemented with elementary components, those generally being f ...
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