4 projets européens trouvés
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TERMINÉ
Enhanced substrates and GaN pilot lines enabling compact power applications (PowerBase)
Date du début: 1 mai 2015, Date de fin: 30 avr. 2018,
The key objective of PowerBase “Enhanced substrates and GaN pilot lines enabling compact power applications” is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment grow ...
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40
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TERMINÉ
MOEMS:Micro-Optical MEMS, micro-mirrors and pico-projectors (LAB4MEMS II)
Date du début: 1 juin 2014, Date de fin: 1 juin 2017,
Micro-Optical MEMS, micro-mirrors and pico-projectors.Lab4MEMS II will feature the Pilot Line for innovative technologies on advanced Micro-Opto-Electro-Mechanical Systems (MOEMS). This is not just a special class of MEMS systems in fact, but it deals with MEMS merged with Micro-optics, which involves sensing or manipulating optical signals on a very small size scale, using integrated mechanical, ...
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21
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TERMINÉ
Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip platformemploying 3D Integration (ATHENIS_3D)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
... mastered for the first time. This will be achieved by combining TSV and HV-CMOS technology from ams with CMOS and Cu-TSV technology from CEA-Leti, MRAM technology from Crocus and WLP technology from Besi. Platform scalability will be proven by flipchip packaging of 14nm CMOS samples on the interposer. New modules for TSVs, MRAM and Passives embedded in TSV technology will be developed to enable ...
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11
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TERMINÉ
Ultra thin chip integration process for low cost communicative polymer foils (Chip2Foil)
Date du début: 1 janv. 2010, Date de fin: 30 avr. 2013,
Chip2Foil aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a high volume, reel-to-reel production concept. This competence allows realising a broad variety of disposable communicative packages. These packages provide increased interaction between the packed product, the package and the user through near-field communicat ...
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