Date du début: 1 nov. 2015,
Date de fin: 30 avr. 2019,
The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, ...
Date du début: 1 oct. 2013,
Date de fin: 30 sept. 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
Date du début: 1 mars 2013,
Date de fin: 29 févr. 2016,
There is a growing range of applications that would benefit from the use of nanostructured coatings. The functional performance of a surface is intimately linked with its structure. The ability to characterise nanostructured coatings is therefore an essential part of their future uptake. However, the ability to examine and characterise at the nano-scale is currently limited to sophisticated, time- ...
Date du début: 1 juin 2011,
Date de fin: 1 mai 2014,
The ERG project focus on the solar energy supply chain, starting form photovoltaic cells (PV) and proceeding with energy extraction (harvesting) techniques, high efficiency power conversion and finally managing the energy distribution inside a smart grid, with the target of different classes of applications, from house to small area, as well as application specific “local grid” (healthcare, automo ...
Date du début: 1 avr. 2012,
Date de fin: 31 mars 2014,
"The objective of this proposal is to develop double side cooled packaging solutions for semiconductors eliminating the use of inherently unreliable aluminium wire bonds and replacing with seamless contacting techniques to either side of the active semiconductor thereby providing a very reliable low thermal resistance,low inductance contact . The solutions developed using innovative additive laser ...
Date du début: 1 déc. 2011,
Date de fin: 30 nov. 2013,
Through a mixture of applied research and development, the Uni-Pack project will deliver technologies to reduce the manufacturing costs and improve the performance of plastic packaged IGBT (Insulated gate bipolar transistor) modules, in particular those for use in Voltage Source Converters (VSC) for High Voltage Direct Current (HVDC) power transmission. VSC technology enables efficient access to r ...
Date du début: 1 nov. 2008,
Date de fin: 31 mars 2011,
"Asbestos fibres are a major cause of disability and death in the construction, decommissioning and related industries. The ‘Porpardet’ project will address this through developing two innovative complementary portable automatic detection systems, based on novel concentrating and analysis methods for asbestos particles and certain other harmful materials of widespread concern, eg mineral quartz/si ...
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