7 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Technology Advances and Key Enablers for 5 nm (TAKE5)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
The TAKE5 project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 10nm technology node and the ECSEL JU project SeNaTe aiming at the 7nm technology node. The main objective of the TAKE5 project is the demonstration of 5nm patterning in line with the industry needs and the ITRS roadmap in the Advanced Patter ...
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13
Participants partenaires
TERMINÉ
Seven Nanometer Technology (SeNaTe)
Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,
The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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41
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TERMINÉ
Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
SEA4KET (Semiconductor Equipment Assessment for Key Enabling Technologies) is an IP proposal taking the consequent step from equipment R&D to equipment assessment experiments. The strategic objective is to effectively combine resources and expertise in a joint assessment of novel equipment for key enabling technologies to foster and accelerate the successful transfer of novel European equipment in ...
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26
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TERMINÉ
Support Action for 450mm topics establishing a Bridge between European EM entities and IDMs, Foundries and Entities Worldwide (Bridge450)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
Five major global semiconductor companies are working in the G450C consortium based in Albany N.Y. to introduce 450mm wafer semiconductor processing and are now installing the first wave of 450mm prototype systems. Intel and TSMC lead this effort with published roadmaps showing pilot lines in 2016, production in 2018. Samsung will soon follow which will force GlobalFoundries, SK Hynix, Toshiba, UM ...
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12
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TERMINÉ
Coordination Action to enable an effective European 450 mm Equipment & Materials Network (ENABLE450)
Date du début: 1 nov. 2012, Date de fin: 31 oct. 2016,
5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently ordering and installing the first wave of 450 mm systems. The major drivers of this effort are Intel and TSMC, which have provide ...
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13
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TERMINÉ
European 450mm Equipment Demo Line (E450EDL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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44
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TERMINÉ
ENERGY FOR A GREEN SOCIETY: FROM SUSTAINABLE HARVESTING TO SMART DISTRIBUTION. EQUIPMENTS, MATERIALS, DESIGN SOLUTIONS AND THEIR APPLICATIONS (ERG)
Date du début: 1 juin 2011, Date de fin: 1 mai 2014,
The ERG project focus on the solar energy supply chain, starting form photovoltaic cells (PV) and proceeding with energy extraction (harvesting) techniques, high efficiency power conversion and finally managing the energy distribution inside a smart grid, with the target of different classes of applications, from house to small area, as well as application specific “local grid” (healthcare, automo ...
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