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 TERMINÉ 
The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fueled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainability, ...
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 14

 TERMINÉ 
The MobiWeld project will develop a prototype, mobile Friction Stir Welding (FSW) system, which will be designed and constructed for use in final fabrication/assembly in a shipyard environment.It will deliver the following benefits:• Offer a superior method of fabricating aluminium ship panelling – reducing fabrication costs of ships and ship components by €500k for a 2,000 tonne cruise liner• Dev ...
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 9

 TERMINÉ 

Detection of kissing bonds in friction stir welds in aero structures (StirScan)

Date du début: 1 déc. 2012, Date de fin: 30 nov. 2014,

The proposed StirScan project will develop a NDT system in order to address the challenging problem of detecting kissing bonds in Friction Stir Welds (FSW). FSW is a relatively new joining technique for aluminium alloys which offers good joint performance and excellent reproducibility – this is of significant interest to the aerospace sector, where fatigue performance is particular crucial. Howeve ...
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 8

 TERMINÉ 
"The total EU electronics industry employs ≈20.5 million people, sales exceeding €1 trillion and includes 396,000 SMEs. It is a major contributor to EU GDP and its size continues to grow fuelled by demand from consumers to many industries. Despite its many positive impacts, the industry also faces some challenges connected with the enormous quantity of raw materials that it needs for sustainabilit ...
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 11

 TERMINÉ 
There is relentless consumer demand for electronics equipment offering miniaturisation with higher functionality (e.g. cell phones playing music and movies whilst also offering email/SMS/camera functions). The industry is therefore continuously aiming for increases in integrated circuit miniaturization, processor speeds and circuit densities. The resultant increasing numbers of ever finer features ...
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