12 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
Advanced laser ablation barrier films for organic and large area electronic devices (ALABO)
Date du début: 1 janv. 2015, Date de fin: 31 déc. 2017,
The overall objective of this project is developing organic electronic building elements on flexible substrates with monolithically integrated barrier foils as substrate. The barrier acts as the inevitable protection against atmospheric gases as water vapor and oxygen, as the most crucial agents for unwanted material degradation processes. This topic is one of the keys for enhancing both the perfo ...
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7
Participants partenaires
TERMINÉ
Printed Logic for Applications of Screen Matrix Activation Systems (PLASMAS)
Date du début: 1 nov. 2013, Date de fin: 30 avr. 2017,
The EU has lost a significant share of the electronics manufacture sector to the Far East, resulting in a negative trade balance of >€100bn/year within this sector. This is (in part) due to the current manufacturing technologies that are based on subtractive processing that are expensive, wasteful and energy intensive, making manufacture in the EU economically and environmentally unfeasible. Print ...
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11
Participants partenaires
TERMINÉ
Semiconductor Equipment Assessment for Key Enabling Technologies (SEA4KET)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
...d of assessing equipment for Key Enabling Technologies: SEA4KET concentrates on process and metrology systems for important enablers of future technologies: 450 mm wafer equipment, SiC material and 3D processing. The proposal comprises 15 sub-projects each dedicated to a specific equipment. The assessment activities were to a lesser extent chosen by "high S&T" excellence, but by their expected cha ...
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26
Participants partenaires
TERMINÉ
The Development and Construction of a Master Mould for Riblet Construction (Riblet)
Date du début: 1 mars 2013, Date de fin: 30 sept. 2015,
The project will consist of the construction of a seamless, precision welded flat master mould manufactured to such a high quality to enable the embossing of painted riblets onto the outer surface of an aircraft. The riblets reduce significantly the drag characteristics under turbulent air flow. Each riblet is spaced 96µm apart and will achieve a sharp angular tip angle of 45 degrees. The depth of ...
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5
Participants partenaires
TERMINÉ
Efficient, low-cost, stable tandem organic devices (X10D)
Date du début: 1 oct. 2011, Date de fin: 30 sept. 2014,
X10D aims to enable organic photovoltaics (OPV) to enter the competitive thin-film PV market. It will achieve this by pooling the knowledge and expertise of the leading research institutes and start-up companies in Europe, and is the first project of its kind to leverage this knowledge irrespective of the processing technology. It will use the strengths available in device efficiency and architect ...
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20
Participants partenaires
TERMINÉ
Technology & Design Kits for Printed-Electronics (TDK4PE)
Date du début: 1 oct. 2011, Date de fin: 30 sept. 2014,
The goal of Technology & Design Kit for Printed Electronics (TDK4PE) is to set a fundamental change in the way printed electronics (PE) are designed and manufactured in Europe, with the aim of reducing costs and time-to-market by more than an order of magnitude for more complex designs than ever before by addressing thousands of transistors on a substrate.The key is to develop a methodology to ena ...
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10
Participants partenaires
TERMINÉ
Printable, organic and large-area realisation of integrated circuits (POLARIC)
Date du début: 1 janv. 2010, Date de fin: 30 juin 2014,
The objective of the project is to realise high-performance organic electronic devices and circuits using large-area processing compatible fabrication methods. The high performance of the organic circuits referred to here means high speed (kHz-MHz range), low parasitic capacitance, low operating voltage, and low power consumption. The related organic thin film transistor (OTFT) fabrication develop ...
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15
Participants partenaires
TERMINÉ
Best-Reliable Ambient Intelligent Nano Sensor Systems (e-BRAINS)
Date du début: 1 sept. 2010, Date de fin: 28 févr. 2014,
...ficantly higher integration densities. Performance, multi-functionality and reliability of such complex heterogeneous systems will be limited mainly by the wiring between the subsystems. Suitable 3D integration technologies create a basis to overcome these drawbacks with the benefit of enabling minimal interconnection lengths. In addition to enabling high integration densities, 3D integration is a ...
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20
Participants partenaires
TERMINÉ
Innovation for Digital Fabrication (Diginova)
Date du début: 1 mars 2012, Date de fin: 28 févr. 2014,
Most products are produced by means of the established mass production infrastructure. Traditionally, this involves large stocks, high manual labor, large capital investments, high energy use, long distance transportation. Although many advanced new materials have unique functional properties that hold a great promise for innovation, they often need to meet the criteria and characteristics of this ...
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22
Participants partenaires
TERMINÉ
Large Area Photonic Crystal Chemical Sensors (PHOTOSENS)
Date du début: 1 févr. 2011, Date de fin: 31 janv. 2014,
The PHOTOSENS project aims to develop a low-cost, mass-manufacturable, nano-structured, large-area multi-parameter sensor array using Photonic Crystal (PC) and enhanced Surface Enhanced Raman Scattering (SERS) methodologies for environmental and pharmaceutical applications. Integrating the PC and SERS based sensors with integrated optics coupling structures within a single sensor platform allows t ...
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9
Participants partenaires
TERMINÉ
An innovative low-cost and flexible 3D scanning system (NavOScan)
Date du début: 1 nov. 2010, Date de fin: 31 juil. 2013,
...e important having high potential for a boost in this market. The accurate and easy creation of three dimensional images of real objects is achieved by sequential measured surface scans. Existing 3D white light scanners suffer from complex manual post-processing due to inaccurate measured data and technical limited number of surface scans. The goal is to create a system with remarkable advantages ...
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9
Participants partenaires
TERMINÉ
Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test (ESIP)
Date du début: 1 mai 2010, Date de fin: 1 avr. 2013,
The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, th ...
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