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 TERMINÉ 
Description Among the physical limitations which challenge progress in nanoelectronics for aggressively scaled More Moore, Beyond CMOS and advanced More-than-Moore applications, process variability and the interactions between and with electrical, thermal and mechanical effects are getting more and more critical. Effects from various sources ...
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 9

 TERMINÉ 

Semiconductor Equipment Assessment Leveraging Innovation (SEAL)

Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,

Description Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry. SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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 39

 TERMINÉ 

pHotonics ELectronics functional Integration on CMOS (HELIOS)

Date du début: 1 mai 2008, Date de fin: 30 nov. 2012,

Photonics on CMOS is a candidate technology for applications where functional integration is needed for improving system performance while reducing size and cost.Functional demonstration of basic building blocks such as a µlaser, a detector, coupling, and link has been realized in previous research projects. As a next step the HELIOS project proposes to integrate photonics components with integrat ...
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 22

 TERMINÉ 

Automotive Tested High-voltage Embedded Non-volatile memory Integrated SoC (ATHENIS)

Date du début: 1 janv. 2008, Date de fin: 31 déc. 2010,

More than 20% of the value of each car already comes from embedded electronics. Keeping costs and space for additional functionality low requires further integration of electronic components such as low and high voltage devices and memory on a single System-on-Chip (SoC). SoC technologies for segments with lower reliability requirements are already available. However, there are no cost-effective t ...
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 8