...lability will be proven by flipchip packaging of 14nm CMOS samples on the interposer. New modules for TSVs, MRAM and Passives embedded in TSV technology will be developed to enable 200C applications. Valeo will provide system specifications, development and demo car evaluation. The other partners contribute to the TSV, WLP and IPD technology (FhG, CEA-Leti) and develop the required novel design, s ...