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Ultra thin chip integration process for low cost communicative polymer foils (Chip2Foil)
Date du début: 1 janv. 2010, Date de fin: 30 avr. 2013,
Chip2Foil aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a high volume, reel-to-reel production concept. This competence allows realising a broad variety of disposable communicative packages. These packages provide increased interaction between the packed product, the package and the user through near-field communicat ...
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