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Circuit Stability Under Process Variability and\n Electro-Thermal-Mechanical Coupling (SUPERTHEME)
Date du début: 1 oct. 2012, Date de fin: 30 sept. 2015,
Description
Among the physical limitations which challenge progress in nanoelectronics for aggressively scaled More Moore, Beyond CMOS and advanced More-than-Moore applications, process variability and the interactions between and with electrical, thermal and mechanical effects are getting more and more critical. Effects from various sources ...
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