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Multi-Sensor-Platform for Smart Building Management (MSP)
Date du début: 1 sept. 2013, Date de fin: 31 août 2016,
The concept of the MSP project is based on a multi-project wafer approach that enables the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The central objective of the MSP-project is the development of a technology and manufacturing platform for the 3D-integration of sophisticated components and sensors with CMOS technology being the sound foundat ...
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