9 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
3D Advanced Metrology and materials for advanced devices (3DAM)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges w ...
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18
Participants partenaires
TERMINÉ
Seven Nanometer Technology (SeNaTe)
Date du début: 1 avr. 2015, Date de fin: 31 mars 2018,
The SeNaTe project is the next in a chain of thematically connected ENIAC JU KET pilot line projects which are associated with 450mm/300mm development for the 12nm and 10nm technology nodes. The main objective is the demonstration of the 7nm IC technology integration in line with the industry needs and the ITRS roadmap on real devices in the Advanced Patterning Center at imec using innovative devi ...
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41
Participants partenaires
TERMINÉ
HIGH EFFICIENCY REAR CONTACT SOLAR CELLS AND ULTRA POWERFUL MODULES (HERCULES)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
"The European photovoltaics PV market still represents the predominant share of worldwide installations and electricity generated from PV is becoming increasingly competitive, with an average levelized cost of energy (LCOE) estimated to be between 0.10–0.16 €/kWh in 2011 . This constant reduction of LCOE means that the European industry can only regain its competitiveness with (i) a concomitant re ...
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16
Participants partenaires
TERMINÉ
European 450mm Equipment Demo Line (E450EDL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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44
Participants partenaires
TERMINÉ
Development and scale-up of nanostructured based materials and processes for low cost high efficiency chalcogenide based photovoltaics (SCALENANO)
Date du début: 1 févr. 2012, Date de fin: 31 juil. 2015,
This project will exploit the potential of chalcogenide based thin film photovoltaic technologies for the development and scale-up of new processes based on nanostructured materials for the production of high efficiency and low cost photovoltaic devices and modules compatible with mass production requirements. Cu(In,Ga)(S,Se)2 (CIGS) chalcogenide based devices have the highest efficiency of all th ...
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14
Participants partenaires
TERMINÉ
Advanced TEchnology MOdelling for eXtra-functionality devices (ATEMOX)
Date du début: 1 juil. 2010, Date de fin: 30 nov. 2013,
Description
Extends the capabilities of TCAD to the modelling of leakage currents and technologies for low-leakage ultra-shallow junctions.Within previous European projects process simulation has been brought to a state which allows in industrial environments a sufficiently accurate simulation of doping profiles in advanced CMOS technolog ...
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14
Participants partenaires
TERMINÉ
Semiconductor Equipment Assessment Leveraging Innovation (SEAL)
Date du début: 1 juin 2010, Date de fin: 30 sept. 2013,
Description
Seal is an EC-funded project covering semiconductor equipment assessment to strengthen the European semiconductor equipment industry.
SEAL is an integrated project consisting of 17 equipment assessment sub-projects in the area of semiconductor manufacturing equipment. The assessment th ...
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39
Participants partenaires
TERMINÉ
Silicon sUbstrates from an inteGrated Automated pRocess (SUGAR)
Date du début: 1 oct. 2010, Date de fin: 30 sept. 2013,
"Since the silicon wafer still accounts for a substantial part of the cost of solar modules, reducing the silicon consumption per watt peak is one of the most effective ways of reducing the overall cost of PV systems. In this project we propose a methodology to produce a high-efficiency solar module with a very limited amount of Si. The methodology is based on two technologies: the first one for t ...
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11
Participants partenaires
TERMINÉ
European 450mm Equipment & Materials Initiative (EEMI 450)
Date du début: 1 avr. 2010, Date de fin: 1 mars 2013,
Large-scale semiconductor fabrication is now standardised on 300mm diameter wafers. However, as demand grows and node dimensions diminish, major chipmakers are considering offsetting the growing costs of miniaturisation by increasing wafer size to 450mm to cut cost per produced die. A prerequisite is the availability of the required quality wafers and equipment able to handle larger wafers. The EN ...
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