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Tomorrows micro-electronic devices will have to show more functionality and performance at smaller form factor, lower cost and lower energy consumption in order to be competitive on this multi-billion dollar market. Advanced system integration is thus inevitable, a trend bound to joining dissimilar materials with new packaging technologies. These processes must enable lower thermal resistances and ...

"The objective of the project is to provide a joint comprehensive research on the development of light-sensitive active coatings and light-addressable microdispensors based on the incorporated mesoporous photocatalytic particles loaded with active agent (lubricant, biocide, corrosion inhibitor). The coating will include container either with the inorganic scaffold made of photoactive material (TiO ...