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14 projets européens trouvés

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 TERMINÉ 

Photonic Integrated Circuits Assembly and Packaging Pilot Line (PIXAPP)

Date du début: 1 janv. 2017, Date de fin: 31 déc. 2020,

PIXAPP will establish the world’s first open access Photonic Integrated Circuit (PIC) assembly & packaging Pilot Line. It combines a highly-interdisciplinary team of Europe’s leading industrial & research organisations. PIXAPP provides Europe’s SMEs with a unique one-stop-shop, enabling them to exploit the breakthrough advantages of PIC technologies. PIXAPP bridges the ‘valley of death’, providing ...
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 20

 TERMINÉ 

MidInfraRed PHotonics devices fABrication for chemical sensing and spectroscopic applications (MIRPHAB)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2019,

The MIRPHAB (Mid InfraRed PHotonics devices fABrication for chemical sensing and spectroscopic applications) consortium will establish a pilot line to serve the growing needs of European industry in the field of analytical micro-sensors. Its main objectives are to:• provide a reliable supply of mid-infrared (MIR) photonic components for companies incl. in particular SMEs already active in analytic ...
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 19

 TERMINÉ 

Silicon Nitride Photonic Integrated Circuit Pilot line for Life Science Applications in the Visible Range (PIX4LIFE)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2019,

Photonics is essential in today’s life science technology. PIX4life will mature a state of the art silicon nitride (SiN) photonics pilot line for life science applications in the visible range and pave the way to make it accessible as an enabler for product development by a broad range of industrial customers. We aim at 1) establishing a validated CMOS compatible SiN technology platform in the vis ...
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 16

 TERMINÉ 

A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices (PLASMOfab)

Date du début: 1 janv. 2016, Date de fin: 31 déc. 2018,

PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated ...
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 10

 TERMINÉ 

Converged Optical-Mobile Access Networks with Dynamic and Efficient Resource allocation (COMANDER)

Date du début: 1 oct. 2013, Date de fin: 30 sept. 2017,

...ieves these objectives via the fruitful collaboration of four partners, two from academia, i.e., Aristotle University of Thessaloniki (AUTH) and Technical University Berlin (TUB), and two SMEs, i.e., PhoeniX Software B.V. (PHX) and iQuadrat (IQU). As a whole, the partners have consolidated and complementary expertise in the engineering, design, analysis, simulation and experimentation that are dem ...
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 4

 TERMINÉ 

Photonic Libraries And Technology for Manufacturing (PLAT4M)

Date du début: 1 oct. 2012, Date de fin: 31 mars 2017,

Description "PLAT4M will make silicon photonics ready for transition to industry"Silicon is now a mature integration platform that has brought CMOS microelectronics to mass-market application. The PLAT4M vision is that silicon photonics will lead to a similar revolution in the photonics sector.Over the past years silicon photonics has see ...
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 18

 TERMINÉ 

European Initiative for the standardization and manufacturability of complex micro-fluidic devices (MFMANUFACTURING)

Date du début: 3 mars 2014, Date de fin: 3 mars 2017,

The objective of the MFManufacturing project is to bring the manufacturing of microfluidic devices to the same level of maturity and industrialisation of electronic devices, enabling them to address more widely in the healthcare needs. Electronic devices, which have been on the market for many years, have benefited from the long going standardization of electronic components, and were therefore ea ...
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 21

 TERMINÉ 

Photonics for High-Performance, Low-Cost & Low-Energy Data Centers, High Performance Computing Systems:Terabit/s Optical Interconnect Technologies for On-Board, Board-to-Board, Rack-to-Rack data links (PhoxTroT)

Date du début: 1 oct. 2012, Date de fin: 30 sept. 2016,

PhoxTrot is a large-scale research effort focusing on high-performance, low-energy and cost and small-size optical interconnects across the different hierarchy levels in Data Center and High-Performance Computing Systems: on-board, board-to-board and rack-to-rack. PhoxTrot will tackle optical interconnects in a holistic way, synergizing the different fabrication platforms (CMOS electronics, Si-pho ...
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 22

 TERMINÉ 

Photonic Advanced Research And Development for Integrated Generic Manufacturing (PARADIGM)

Date du début: 1 oct. 2010, Date de fin: 31 mai 2015,

The objective of PARADIGM is to effect a fundamental change in the way photonic integrated circuits (PICs) based on indium phosphide (InP) are designed and manufactured in Europe, with the aim of reducing the costs of design, development and manufacture by more than an order of magnitude and making more complex and capable designs possible than ever before.The key step is to develop a generic plat ...
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 19

 TERMINÉ 

100 Gb/s Optical RAM on-chip:\nSilicon-based, integrated Optical RAM enabling High-Speed Applications in Computing and Communications (RAMPLAS)

Date du début: 1 sept. 2011, Date de fin: 28 févr. 2015,

For over two decades ICT witnesses the steadily increasing gap between processor and memory speed. RAM is too slow to keep up with processor speeds, creating a bottleneck in system performance. To address this, RAMPLAS will revisit RAM fundamentals and will lay the foundations for optical RAM technology and for optical RAM-enabled green and ultra-fast computing architectures. RAMPLAS will develop ...
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 7

 TERMINÉ 

Technology & Design Kits for Printed-Electronics (TDK4PE)

Date du début: 1 oct. 2011, Date de fin: 30 sept. 2014,

The goal of Technology & Design Kit for Printed Electronics (TDK4PE) is to set a fundamental change in the way printed electronics (PE) are designed and manufactured in Europe, with the aim of reducing costs and time-to-market by more than an order of magnitude for more complex designs than ever before by addressing thousands of transistors on a substrate.The key is to develop a methodology to ena ...
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 10

 TERMINÉ 

pHotonics ELectronics functional Integration on CMOS (HELIOS)

Date du début: 1 mai 2008, Date de fin: 30 nov. 2012,

Photonics on CMOS is a candidate technology for applications where functional integration is needed for improving system performance while reducing size and cost.Functional demonstration of basic building blocks such as a µlaser, a detector, coupling, and link has been realized in previous research projects. As a next step the HELIOS project proposes to integrate photonics components with integrat ...
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 22

 TERMINÉ 

Monolithically Integrated Interferometric Biochips for label-free Early Detection of Human Diseases (PYTHIA)

Date du début: 1 mai 2008, Date de fin: 31 oct. 2011,

The proposed project aims at the development of a novel biochip based on monolithic, fully integrated biosensor array fabricated by standard Si-technology and its application to the early diagnosis of human diseases through label-free and multi-analyte detection.The basic sensor scheme consists of a VIS-NIR light source and a waveguide monolithically fabricated on a silicon wafer, while its princi ...
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 8

 TERMINÉ 

Agile Photonic Integrated Systems-on-Chip enabling WDM Terabit Networks (APACHE)

Date du début: 1 avr. 2008, Date de fin: 30 sept. 2011,

The APACHE project will develop new compact, scalable and cost-optimized photonic integrated components that will be capable of generating, regenerating and receiving amplitude- (OOK) and phase- (DPSK, QPSK) encoded optical signals for high capacity (>100Gb/s) WDM networks. The APACHE concept is based on developing devices having both multi-functionality and agility in order to reach Terabit capac ...
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 7