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 TERMINÉ 

Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)

Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,

One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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 17

 TERMINÉ 
Organic electroluminescence (OLED) holds the promise to deliver flexible, thin, lightweight and power-efficient light sources. Research up until now has been mainly motivated by work on glass-based displays, where the aspects of increased contrast, high viewing angle and response speed are critical. However, intelligent lighting applications are becoming increasingly relevant; here, the unique pro ...
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