4 projets européens trouvés
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TERMINÉ
Enabling MEMS-MMIC technology for cost-effective multifunctional RF-system integration (MEMS-4-MMIC)
Date du début: 1 mai 2008, Date de fin: 30 nov. 2012,
The MEMS-4-MMIC proposal aims at the integration of RF-MEMS switches onto Monolithic Microwave Integrated Circuits (MMIC) creating highly integrated multifunctional building blocks for high-value applications. RF-MEMS will be an essential building block of next-generation smart systems that are characterised by cost-effective and compact designs, high performance, flexibility and configurability.M ...
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8
Participants partenaires
TERMINÉ
Nano-scale ICT Devices and Systems Coordination Action (NanoICT)
Date du début: 1 janv. 2008, Date de fin: 31 déc. 2011,
In the semiconductor industry, CMOS technology will certainly continue to have a predominant market position in the future. However, there are still a number of technological challenges, which have to be tackled if CMOS downscaling should be pursued until feature sizes will reach 10 nm around the year 2015-2020.The NanoICT Coordination Action activities will reinforce and support the whole Europea ...
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13
Participants partenaires
TERMINÉ
All-inorganic nano-rod based thin-film solarcells on glass (ROD-SOL)
Date du début: 1 janv. 2009, Date de fin: 31 déc. 2011,
"Thin film solar cells, based on non-toxic, abundant and air-stable silicon (Si) will probably, based on forecasts, dominate the photovoltaic market in the future and thus replace bulk Si from its leading position. This prognosis is fostered by the strong cost reduction potential due to highly effective materials utilization at low energy consumption. However, thin film Si suffers from inherently ...
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11
Participants partenaires
TERMINÉ
Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)
Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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