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 TERMINÉ 

Rf Engineered substrates to FostER fEm performaNCE (REFERENCE)

Date du début: 1 déc. 2015, Date de fin: 31 mai 2019,

The REFERENCE project aims to leverage a European leading edge Radio Frequency (RF) ecosystem based on RF Silicon On Insulator (SOI) disruptive technology, perceived as the most promising to address performance, cost and integration needs for RF Front End Modules (FEMs)s.The project targets to develop over the next 3 years, innovative solutions from material, engineered substrates, process, design ...
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 18

 TERMINÉ 

Power Semiconductor and Electronics Manufacturing 4.0 (SemI40)

Date du début: 1 mai 2016, Date de fin: 30 avr. 2019,

Addressing European Policies for 2020 and beyond the “Power Semiconductor and Electronics Manufacturing 4.0” (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets w ...
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 38

 TERMINÉ 

Enhanced Power Pilot Line - EPPL (EPPL)

Date du début: 1 avr. 2013, Date de fin: 31 mars 2016,

A sustainable and competitive European power semiconductor industry is essential to support the megatrend developments formulated in the Europe 2020 strategy - climate change, energy security, food security, and health and aging population. In practically all these areas, power semiconductors play a vital role. Thus, it is of paramount importance to defend and further extend Europe’s leading posit ...
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 33

 TERMINÉ 

Processes for MEMS by inkjet enhanced technologies (PROMINENT)

Date du début: 1 mars 2013, Date de fin: 29 févr. 2016,

Prominent aims to incorporate inkjet printing as a part of the MEMS fabrication process. By using maskless, digitally controlled, localized additive processes instead of the subtractive processes used currently, selected steps in the MEMS manufacturing can be done with simplified process sequence. This will result in • lower initial investment cost for a MEMS line• greatly increased flexibility i ...
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 10

 TERMINÉ 
Future electronic power devices and packages will need to demonstrate more performance and functionality at reduced cost, size, weight, energy consumption and thermal budget. Further, increasing reliability demands have also to be met by industry to be competitive in this growing multi-billion Euro market of heterogeneously integrated systems.To respond to these challenges, new innovative nano- an ...
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 18