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5 projets européens trouvés

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 TERMINÉ 
...lts of recent FP7 project to propose the latest passive millimeter wave technology with a synthetic aperture interferometric radiometer. The French company MC2, specialised in radiometric sensors and microwave products and services, aims at developing its business on the rising markets of PMMW technology for security applications and tackle all the stated technical and business challenges to demon ...
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 1

 TERMINÉ 

Energy Efficient Converters using GaN Power Devices (E2COGAN)

Date du début: 1 avr. 2013, Date de fin: 31 mars 2016,

The E2COGaN project will target the demonstration of GaN-on-Si as a disruptive power device technology platform through the whole value chain up to demonstrators with high industrial, societal and environmental relevance. Its innovative character will be proven through a well-balanced and application specific trade-off between the “corner” benefits given by higher efficiency, higher switching freq ...
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 25

 TERMINÉ 
This project will produce a new tool, the Volumetric Scanning Microwave Microscope (VSMM), for non-destructive 3D nanoscale structural characterisation. Full development of this new tool will take place ready for commercial exploitation within the project duration. The consortium, comprising three SMEs, a Large Company, an RTD Performer and two Research Institutions, will develop and commercialise ...
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 8

 TERMINÉ 

Efficient Integrated Security Checkpoints (EFFISEC)

Date du début: 1 mai 2009, Date de fin: 31 janv. 2014,

Illegal immigration and illicit material detection is a growing concern at the European borders; in that respect border security checkpoints must be particularly efficient against any kind of threat. If airport checkpoints controls are today technically improving, land and seaport checkpoints differ strongly from airports ones and are more complex to process. During the last years, most of the eff ...
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 18

 TERMINÉ 

MOdelling and CHAracterization for SiP Signal and Power Integrity Analysis (MOCHA)

Date du début: 1 janv. 2008, Date de fin: 31 mars 2010,

Today advanced System-in-Package(SiP) can integrate several Large-Scale-Integration(LSI) technologies and functionalities (advanced System-on-Chip-SoC),high-density memories,high-performance analogue-block.It's become strategic to analize and detect potential signal and power integrity failures before the prototype phase.The key to success is a set of integrated EDA tools and modelling flows that ...
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 6