2 projets européens trouvés
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TERMINÉ
Joint Equipment and Materials for System-in-Package and 3D-Integration (JEMSIP_3D)
Date du début: 1 avr. 2009, Date de fin: 1 mars 2012,
The objective of the project « Joint Equipment & Materials for System-in-Package and 3D Integration » is to validate technological solutions for the fabrication of high value-added heterogeneous components and systems.This theme, generally known as “More Than Moore”, intends to gather within a unique system a set of various functions, implemented with elementary components, those generally being f ...
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TERMINÉ
Nano Packaging Technology for Interconnect and Heat Dissipation (NANOPACK)
Date du début: 1 nov. 2007, Date de fin: 30 sept. 2011,
One of the major limitations to continued performance increases in the semiconductor and power electronics industries is integration density and thermal management. Continued transistor downscaling is quickly reaching its limits forcing a new focus on heterogeneous integration and 3D packaging technologies to continue performance improvements by reducing interconnect length between memory and mult ...
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