5 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
THINGS2DO (THINGS2D0)
Date du début: 1 janv. 2014, Date de fin: 1 janv. 2018,
Develop the FDSOI ecosystem in Europe, beyond the PLACES2BE Pilot Line, in order to increase the impact of this European technology. At the time of set up of the first KET pilot line the proof of FDSOI was mainly technological. In between then and now, the first realization of a complex silicon chip in FDSOI has shown to the worldwide microelectronics community the capabilities of this technology. ...
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44
Participants partenaires
TERMINÉ
Which Architecture Yields Two Other Generations Of Fully depleted Advanced Substrate and Technologies (WAYTOGO FAST)
Date du début: 1 mai 2015, Date de fin: 30 avr. 2017,
The proposed pilot line project WAYTOGO FAST objective is to leverage Europe leadership in Fully Depleted Silicon on Insulator technology (FDSOI) so as to compete in leading edge technology at node 14nm and beyond preparing as well the following node transistor architecture. Europe is at the root of this breakthrough technology in More Moore law. The project aims at establishing a distributed pilo ...
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32
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TERMINÉ
SMArt systems Co-design (SMAC)
Date du début: 1 oct. 2011, Date de fin: 31 mars 2015,
Smart systems consist of heterogeneous subsystems and components providing different functionalities; they are normally implemented as "Multi-Package on a Board". To fully exploit the potential of current nanoelectronics technologies, as well as to enable the integration of existing/new IPs and "More than Moore" devices, smart system miniaturization and "Multi-Chip in a Package" implementation are ...
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18
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TERMINÉ
Methods for Advanced Multi-Objective Optimization for eDFY of complex Nano-scale Circuits (MANON)
Date du début: 1 oct. 2010, Date de fin: 30 sept. 2014,
Cost control, production efficiency, cycle time and yield are critical quality benchmark for nanoelectronics productions. An increasingly important downside of nano-CMOS technology scaling is the fact that the scaling of feature sizes cannot be accompanied by a suitable scaling of geometric tolerances.In addition, when getting into deep miniaturized dimensions, phenomena like edges or surfaces rou ...
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4
Participants partenaires
TERMINÉ
Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future (THERMINATOR)
Date du début: 1 janv. 2010, Date de fin: 31 déc. 2012,
Electronic devices of the latest generations, being those integrated circuits or discrete components, are often required to operate in harsh environmental conditions, where the temperature may reach over hundred degrees centigrade. Obviously, this has negative impact on several parameters of the electronic devices, ranging from slow-down and transient, recoverable errors to permanent failures and ...
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