10 projets européens trouvés
Recherche sur 125080 projets européens
TERMINÉ
3D Advanced Metrology and materials for advanced devices (3DAM)
Date du début: 1 avr. 2016, Date de fin: 31 mars 2019,
The objective of the 3DAM project is to develop a new generation of metrology and characterization tools and methodologies enabling the development of the next semiconductor technology nodes. As nano-electronics technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges w ...
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18
Participants partenaires
TERMINÉ
Innovative High Resolution Electro-Static printing of Multifunctional Materials. (Hi-Response)
Date du début: 1 mars 2015, Date de fin: 31 août 2018,
The EU is well placed to exploit printed electronic technologies to create greater economic and social benefits for the EU, but only if we are able to commercialise innovative technologies created within the EU.Ink jet printing technologies are at the forefront of printed electronic developments. However, Ink jet printing has only been able to achieve a resolution of >=10um and the viscosity of pr ...
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14
Participants partenaires
TERMINÉ
Enhanced substrates and GaN pilot lines enabling compact power applications (PowerBase)
Date du début: 1 mai 2015, Date de fin: 30 avr. 2018,
...fully committed to achieve the very challenging project goals.The project PowerBase aims to have significant impact on mart regions. High tech jobs in the area of semiconductor technologies and micro/nano electronics in general are expressed core competences of the regions Austria: Carinthia, Styria, Germany: Sachsen, Bavaria and many other countries/ regions involved.
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40
Participants partenaires
TERMINÉ
Bringing innovAtion by Scaling up nanoMATerials and Inks for printing (BASMATI)
Date du début: 1 janv. 2015, Date de fin: 31 déc. 2017,
...ns production for mass markets such as printed electronics. The compatible formulations in high throughput technologies will ensure a reproducible and reliable process for sophisticated fully digital micro-structured devices. Nanosafety will also be carefully considered in BASMATI project.
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11
Participants partenaires
TERMINÉ
Coordination Action to enable an effective European 450 mm Equipment & Materials Network (ENABLE450)
Date du début: 1 nov. 2012, Date de fin: 31 oct. 2016,
5 major global semiconductor companies Intel, Samsung, TSMC, IBM and Global Foundries, have decided to work closely together to bring 450 mm semiconductor processing to a mature level, within a consortium called G450C. This operation, based in Albany N.Y., is currently ordering and installing the first wave of 450 mm systems. The major drivers of this effort are Intel and TSMC, which have provide ...
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13
Participants partenaires
TERMINÉ
European 450mm Equipment Demo Line (E450EDL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
The aim of the E450EDL project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative and proceeded with subsequent projects funded with public money, amongst others NGC450, SOI450, EEM450PR. The demo line resulting from this project will be such that it will enable first crit ...
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44
Participants partenaires
TERMINÉ
Functional joining of dissimilar materials using directed self-assembly of nanoparticles by capillary-bridging (HYPERCONNECT)
Date du début: 1 janv. 2013, Date de fin: 31 déc. 2015,
Tomorrows micro-electronic devices will have to show more functionality and performance at smaller form factor, lower cost and lower energy consumption in order to be competitive on this multi-billion dollar market. Advanced system integration is thus inevitable, a trend bound to joining dissimilar materials with new packaging technologies. These processes must enable lower thermal resistances and ...
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10
Participants partenaires
TERMINÉ
European E&M 450mm Pilotline Readiness (EEM450PR)
Date du début: 1 avr. 2012, Date de fin: 1 mars 2015,
Aim of the EEM450PR project is to continue the engagement of the European semiconductor equipment and materials industry in the 450mm wafer size transition that started with the ENIAC JU EEMI450 initiative. It will also bring about the start of a vision to place an equipment development pilot line in the imec facility in Leuven. This will provide Europe with a complementary activity for 450mm equi ...
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32
Participants partenaires
TERMINÉ
Standardising the nano-scratch test (NANOINDENT-plus)
Date du début: 1 sept. 2012, Date de fin: 28 févr. 2014,
...ed surfaces that will give impact through improved competitiveness of industry and a better quality of life for EU citizens. Nano-scratching clearly operates at a different length scale to macro- and micro-scratch tests, but can be a straightforward extension of the capability of nanoindentation equipment. This is an area where European industry is very strong, three European SMEs have a dominant ...
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9
Participants partenaires
TERMINÉ
Creating and disseminating novel nanomechanical characterisation techniques and standards (NANOINDENT)
Date du début: 1 sept. 2008, Date de fin: 31 août 2011,
"Our project aims to gather, improve, catalogue and present characterisation techniques, methods and equipment for nanomechanical testing. European-wide activities coordinated by a new virtual centre will improve existing nanoindentation metrology to reveal structure-properties relationship at the nano-scale. These methods are the only tools to characterise nanocomposite, nanolayer and interface m ...
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