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A generic CMOS-compatible platform for co-integrated plasmonics/photonics/electronics PICs towards volume manufacturing of low energy, small size and high performance photonic devices (PLASMOfab)
Date du début: 1 janv. 2016, Date de fin: 31 déc. 2018,
PLASMOfab aims to address the ever increasing needs for low energy, small size, high complexity and high performance mass manufactured PICs by developing a revolutionary yet CMOS-compatible fabrication platform for seamless co-integration of active plasmonics with photonic and supporting electronic. The CMOS-compatible metals Aluminum, Titanium Nitride and Copper, will be thoroughly investigated ...
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