3 projets européens trouvés
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TERMINÉ
Efficient Silicon Multi-Chip System-in-Package Integration - Reliability, Failure Analysis and Test (ESIP)
Date du début: 1 mai 2010, Date de fin: 1 avr. 2013,
The ENIAC JU project ESiP is addressing the issues of reliability, failure analysis and testing in innovative system-in-package (SiP) solutions. Highly integrated systems with greater miniaturisation and increased functionality open new markets and improve the quality of life through a wide range of applications. In particular, higher systems integration technologies using multi-chip packaging, th ...
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40
Participants partenaires
TERMINÉ
COmpact MOdelling Network (COMON) (COMON)
Date du début: 1 déc. 2008, Date de fin: 30 nov. 2012,
"The goal of our Network is to address the full development chain of Compact Modeling (CM) of advanced CMOS and III-V technologies, from the technology level to the system level. Our mission is driven by the need to enhance scientific knowledge, transfer scientific and technological knowledge from academia to industry, to strengthen the European integrated circuit (IC) industry with powerful desi ...
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16
Participants partenaires
TERMINÉ
Advanced Sensors and lightweight Programmable middleware for Innovative Rfid Enterprise applications (ASPIRE)
Date du début: 1 janv. 2008, Date de fin: 30 juin 2011,
ASPIRE will research and provide a radical change in the current RFID deployment paradigm through innovative, programmable, royalty-free and privacy friendly middleware. This new middleware paradigm will be particular beneficial to European SME, which are nowadays experiencing significant cost-barriers to RFID deployment.European networked enterprises in general and SME in particular are still rel ...
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