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10 projets européens trouvés

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 TERMINÉ 
...analysis methods will be used for multi scale modelling targeting on the simulation of aging mechanisms for a reliable lifetime prediction and enhancement. In addition, the latest generation of anode materials based on silicon as well as a prelithiation process for lifetime enhancement will be implemented in the cell manufacturing process. The implementation of high energy materials combined with ...
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 9

 TERMINÉ 

Power Semiconductor and Electronics Manufacturing 4.0 (SemI40)

Date du début: 1 mai 2016, Date de fin: 30 avr. 2019,

Addressing European Policies for 2020 and beyond the “Power Semiconductor and Electronics Manufacturing 4.0” (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets w ...
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 38

 TERMINÉ 

Flexible FE/BE Sensor Pilot Line for the Internet of Everything (IoSense)

Date du début: 1 mai 2016, Date de fin: 30 avr. 2019,

The EU has set the stage to empower semiconductor manufacturing in Europe being one of the key drivers for innovation and employment and creator for answers to the challenges of the modern society. Aim of IoSense is to boost the European competitiveness of ECS industries by increasing the pilot production capacity and improving Time-to-Market for innovative microelectronics, accomplished by establ ...
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 33

 TERMINÉ 

Crack growth threshold analysis in TiAl alloys (TiAlCracks)

Date du début: 1 mars 2016, Date de fin: 28 févr. 2019,

The objective of the project is to investigate the fatigue crack growth (FCG) threshold and rate for long as well as short cracks of second generation TiAl alloys suitable for use in the Intermediate Pressure Turbine (IPT) of the UltraFanTM engine. The work includes in detail all investigations specified in the Call for Proposals JTI-CS2-2014-CFP01-ENG-03-04, that are:• determination of the FCG th ...
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 1

 TERMINÉ 

Research into enhanced tracks, switches and structures (IN2TRACK)

Date du début: 1 sept. 2016, Date de fin: 28 févr. 2019,

Research into Enhanced Track, Switches and StructureThe railway of the future needs to meet the predicted growth in societal demand in terms of capacity and service, address the environmental challenges of the 21st century, and enable the political objectives of the European Union. IN2TRACK is to set the foundations for a resilient, consistent, cost-efficient, high capacity European network by del ...
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 26

 TERMINÉ 

Metrology for future 3D-technologies (METRO4-3D)

Date du début: 1 févr. 2016, Date de fin: 31 janv. 2019,

Within the food chain of equipment delivery for the semiconductor industry, Europe has kept a very strong position in the metrology area with many companies establishing themselves as main leaders in the field. Hence in line with the objectives of the ICT25 call for innovation action to overcome the (initial) barriers for the successful commercialization of novel European products, this project a ...
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 9

 TERMINÉ 

Pilot Optical Line for Imaging and Sensing (POLIS)

Date du début: 6 janv. 2014, Date de fin: 6 janv. 2018,

The KET pilot line project POLIS is aimed at maintaining and furthering the innovation capability of CMOS image and optical sensors in Europe. An existing ST CMOS high volume production line, unique in Europe, will serve as the basis of the proposed project. The strategy behind POLIS lies in the development of specific technological modules and to implement them at pilot line level on the existing ...
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 20

 TERMINÉ 

Excellence in Speed and Reliability for More Than Moore Technologies (ERAMP)

Date du début: 1 avr. 2014, Date de fin: 1 avr. 2017,

Europe’s strengths are based on the deep knowledge and market position in automotive industry, industrial electronics industry and leading know how for More-than-Moore based embedded system. It is of vital interest for the electronics manufacturers in Europe to have fast access to reliable prototypes of electronic devices as well as competitive advanced manufacturing of such devices made in Europe ...
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 26

 TERMINÉ 

Multi-Sensor-Platform for Smart Building Management (MSP)

Date du début: 1 sept. 2013, Date de fin: 31 août 2016,

The concept of the MSP project is based on a multi-project wafer approach that enables the development of highly innovative components and sensors based on Key Enabling Technologies (KETs). The central objective of the MSP-project is the development of a technology and manufacturing platform for the 3D-integration of sophisticated components and sensors with CMOS technology being the sound foundat ...
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 17

 TERMINÉ 
...ent and environmentally friendly turbine engines using high-strength alloys. As a decisive part of the supply chain, the EU metal spinning industry is increasingly requested to form these challenging materials. To keep quality demands and to stay competitive against new manufacturers in BRIC and other countries, metal spinning companies, which are mostly SMEs, strive for developing new technologie ...
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 7