2 projets européens trouvés
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TERMINÉ
Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip platformemploying 3D Integration (ATHENIS_3D)
Date du début: 1 nov. 2013, Date de fin: 31 oct. 2016,
Automotive represents 12% of the EU industrial GDP. 20% of the value of a car is already electronics and 10% of this are IC components. Minimizing costs and space for additional functionality requires further integration. The EU project ATHENIS has successfully addressed System-on-Chip (SoC) integration of CMOS, high voltage and embedded memory for harshest automotive conditions. Further cost redu ...
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TERMINÉ
Thermoplastically deformable circuits for embedded randomly shaped electronics (TERASEL)
Date du début: 1 oct. 2013, Date de fin: 30 sept. 2016,
The overall aim of the TERASEL project is the development, the industrial implementation and the application in a wide range of domains of large area, cost-effective, randomly shaped electronics and sensor circuit technologies. More specifically the TERASEL objectives are the following : To develop a basic technology platform for rigid large-area randomly shaped electronic circuits. Key common fe ...
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