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Packaging of futuRe Integrated ModulAr Electronics (PRIMAE)
Date du début: 1 nov. 2010, Date de fin: 31 oct. 2014,
"Affordable transport for the citizen relies on innovative solutions and technologies that will result in lower costs and lead-time of the aircraft and its systems. In this area, the packaging of on-board computers is an important contributor.The Packaging of futuRe Integrated ModulAr Electronics (PRIMAE) objective is to develop a new flexible, robust and open aeronautical packaging for the next g ...
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